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Products > Packages > Semiconductor Device Mount Manual > SOLDERING GENERAL > Rework >

CHAPTER 1 SOLDERING GENERAL


1.3 Rework

(3) Supplying solder paste

 

Solder supply during rework is done using specialized jigs and tools. Examples for wide spacing and narrow spacing between parts are described below.

<Relatively wide spacing between parts>

As shown in Figure 1-3-7, fix the partial stencil on the printed wiring board using tape, and print the solder paste with a squeegee (Figure 1-3-8).

 


Figure 1-3-7. Partial Stencil Attached

Figure 1-3-8. Solder Paste Printed on Partial Stencil

<Narrow spacing between parts>

If the spacing between parts is too narrow to attach a simple partial stencil, there is also the method of supplying solder paste on the BGA balls, as shown in Figure 1-3-9.
The procedure is shown below.

  1. Fix the package with a jig, etc. (Figure 1-3-10).
  2. Fix the partial stencil to cover the package as shown (Figure 1-3-11).
  3. Print the solder paste with a squeegee.

Figure 1-3-9. Solder Paste Printed on BGA

Figure 1-3-10. BGA Set on Jig

Figure 1-3-11. Stencil Set on BGA
To 1.3 (2) Removing solder (pad cleaning)To 1.3 (4) Remounting package (mounting and reflow)