Semiconductor Device Mount Manual CHAPTER 1 SOLDERING GENERAL 1.3 Rework

Rework, as described in this chapter, refers to removing a device soldered to a printed wiring board and attaching a new device in its place. The rework method (SMD type, THD type, etc.) differs according to the device package shape (Figures 1-3-1, 1-3-2). (1) Remove package (2) Remove solder (3) Supply solder paste (4) Remount package (5) Visual check Figure 1-3-1. SMD Type Rework Process (1) Remove package (2) Remove solder (3) Remount package (4) Soldering (5) Visual check Figure 1-3-2. THD Type Rework Process

The section starting from the next page describes each process taking the case of a BGA package as an example.

Remark

The rework method is introduced using examples in this chapter. Connections and device reliability after rework are not guaranteed.