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Products > Packages > Semiconductor Device Mount Manual > SOLDERING GENERAL > Rework >

CHAPTER 1 SOLDERING GENERAL


1.3 Rework

(2) Removing solder (pad cleaning)

 

Neatly remove the solder that remains on the pad using a solder sucker, soldering iron, solder wick, etc. after applying flux. Figure 1-3-5 shows the pad states following cleaning using these various methods.


(a) Solder sucker

(b) Soldering iron

(c) Solder wick
Figure 1-3-5. Pad States Following Cleaning

Pad cleaning must be performed with care.
Leftover solder residue and projections cause the metal mask to not closely adhere to the substrate during solder paste printing, leading to improper solder paste supply.
Moreover, when the solder resist peels all the way to an adjacent through-hole, the solder paste printed on the pad gets sucked to the through-hole during reflow, which may cause improper connection.
Figure 1-3-6 shows examples of cleaning work defects.


(a) Left-over solder

(b) Projection

(c) Peeling solder resist
Figure 1-3-6. Examples of Cleaning Work Defects
To 1.3 (1) Removing packageTo 1.3 (3) Supplying solder paste