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Products > Packages > Semiconductor Device Mount Manual > SOLDERING GENERAL > Soldering Methods >

CHAPTER 1 SOLDERING GENERAL


1.1 Soldering Methods
1.1.3 Adaptation by package types

Available soldering methods due to package type.
An example where soldering methods are classified by package is shown below.

Table 1-1-2. Soldering Method Classification by package
  Soldering Method DIP SOP, TSOP, QFP SOJ BGA, CSP
Partial heating method Soldering iron Available Available Not available Not available
Hot air Available Available Available Available
Total heating method Infrared reflow Not available Available Available Available
Convection Not available Available Available Available
Convection+ Infrared Not available Available Available Available
VPS Not available Available Available Available
Flow (wave) soldering Available Available for a lead pitch of 0.65 mm or more Not available Not available

Caution Select the soldering method best suited to your application by taking into consideration the advantages and disadvantages of each soldering method, as well as the heat resistance of the parts.

To 1.1.2(7) Flow (Wave) solderingTo 1.2 Soldering Process Flow