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Products > Packages > Semiconductor Device Mount Manual > SOLDERING GENERAL > Soldering Methods >

CHAPTER 1 SOLDERING GENERAL


1.1 Soldering Methods
1.1.2 Features of soldering method

(6) Vapor phase reflow soldering (VPS)

This method consists of heating to a boiling temperature a special inert liquid, and then subjecting the SMD to the saturated steam to achieve soldering by latent heat.


The features of VPS is described as follows.

1. Advantage
· Low thermal stress
· Even heating of components regardless of their shape
· Accurate temperature control through use of latent heat
· Extremely high heat transfer efficiency makes it possible to lower the heating temperature and shorten the soldering time.
· Little oxidation and dirt on the soldered joint because soldering is performed in inert atmosphere.

2. Disadvantages
· High running cost
Figure 1-1-6. Vapor Phase Reflow Soldering

To 1.1.2(5) Convection-infrared reflow solderingTo 1.1.2(7) Flow (Wave) soldering