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Products > Packages > Semiconductor Device Mount Manual > SOLDERING GENERAL > Soldering Methods >

CHAPTER 1 SOLDERING GENERAL


1.1 Soldering Methods
1.1.2 Features of soldering method

(3) Infrared reflow soldering

This method consists of heating the SMD with the heat generated from an infrared panel heater and soldering it onto the PWB.
The radiation efficiency of the infrared ray varies depending on the color and shape of the SMD to be soldered. Temperature variations may occur as the result of uneven coloring on the SMD's surface.


The features of the infrared reflow is described as follows.

1. Advantages

·

Low running cost and excellent maintainability

·

Short soldering time

2. Disadvantages

·

Temperature rise on the leads greatly depends on the package size.

·

Great thermal stress

·

The temperature of shadowed regions may not rise because infrared radiation does not reach them.
Figure 1-1-3. Infrared Reflow Soldering


To 1.1.2(2) Hot air solderingTo 1.1.2(4) Convection reflow soldering