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CHAPTER 1 SOLDERING GENERAL


1.1 Soldering Methods
1.1.2 Features of soldering method

(4) Convection reflow soldering

Convection reflow soldering is an improved method that solves the problems of infrared reflow soldering, i.e. uneven temperatures of the PWB and SMDs. This method also solves the problem of vapor phase soldering (VPS)Note--high running cost.
The principle of convection reflow is to heat the SMDs by convective heat transfer, i.e., by making heated air circulate in an oven. Consequently, even if the thermal capacity of the PWB differs from that of the SMDs, the temperatures of the PWB and SMDs become uniform after the lapse of a certain time.


The features are of the convection reflow soldering are described as follows.

1. Advantages

·

Excels in temperature uniformity compared to infrared reflow soldering.

·

Relatively low thermal stress


2. Disadvantages

·

Slightly longer soldering time than infrared reflow.
Figure 1-1-4. Convection Reflow Soldering

Note   Refer to 1.1.2(6) Vapor phase reflow soldering (VPS).
To 1.1.2(3) Infrared reflow solderingTo 1.1.2(5) Convection-infrared reflow soldering