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Products > Packages > Semiconductor Device Mount Manual > SOLDERING GENERAL > Soldering Methods >

CHAPTER 1 SOLDERING GENERAL


1.1 Soldering Methods
1.1.2 Features of soldering method

Table 1-1-1. Comparison with Soldering Methods
  Soldering Method
 Items for Comparison
Heat Stress on Package Variances in Package Component Temperatures Running Costs
Partial heating method Soldering iron Low High High
Hot air Low High High
Total heating method Infrared reflow High High Low
Convection reflow High Medium Low
Convection+ Infrared High Medium Low
VPS Medium Medium Medium
Flow (wave) soldering THD Low High Low
SMD High High Low

In following (1) to (7), an outline is shown of each method that belongs with partial heating or total heating. (Please click following items.)

Partial heating method Total heating method
(1) Soldering iron (3) Infrared reflow
(2) Hot air (4) Convection reflow

(5) Convection + infrared reflow

(6) VPS (Vapor Phase Soldering)

(7) Flow (wave) soldering

Caution: Select the soldering method best suited to your application by taking into consideration the advantages and disadvantages of each soldering method, as well as the heat resistance of the parts.

To 1.1.1 Types of soldering methodTo 1.1.2(1) Soldering with soldering iron