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CHAPTER 1 SOLDERING GENERAL
1.1 Soldering Methods
1.1.2 Features of soldering method
| (1) Soldering with soldering iron |
| This method consists in using a soldering iron to solder the package leads and printed circuit with wire solder, etc. Determine the soldering temperature of the soldering iron to be used according to the size and shape of the location to be soldered, and the melting point of the solder. If the soldering temperature is too high, the printed circuit may peel off from PWB and have various degradation caused by overheat. The actual soldering temperature must be determined according to the thermal capacity of the SMD. It is actually recommended that the temperature characteristics of the SMD be actually measured to determine the soldering temperature. Whenever possible, use a soldering iron whose temperature can be adjusted. |
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