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Products > Packages > Semiconductor Device Mount Manual > SOLDERING GENERAL > Soldering Methods >

CHAPTER 1 SOLDERING GENERAL


1.1 Soldering Methods
1.1.2 Features of soldering method

(7) Flow (Wave) soldering

This method consists in forcing out molten solder in a soldering bath to the component on the PWB.


The features of this method is described as follows.

1. Advantages

·

 High productivity (soldering can be completed in a few seconds)

2. Disadvantages

·

 Difficult to solder various packages (such as fine-pitch and J-lead package)

 

  
Figure 1-1-7. Flow (Wave) Soldering


To 1.1.2(6) Vapor phase reflow soldering (VPS)To 1.1.3 Adaptation by package types