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Products > Packages > Semiconductor Device Mount Manual > SOLDERING GENERAL >

CHAPTER 1 SOLDERING GENERAL


1.1 Soldering Methods
1.1.1 Types of soldering method

Soldering methods are broadly divided into two types: the partial heating method and the total heating method.

Partial heating method.....heat is applied to the package leads and/or PWB in a localized manner.
[Types] There are two types of soldering methods:
1) Soldering iron
2) Hot air
[Feature] Partial heating involves less heat stress on the device and wiring board, but is unsuitable for large volume production.
Therefore, this method is mainly used to correct soldering or for devices with a low heat resistance.

Total heating method.....heat is applied to the entire package and/or PWB.
[Types] There are two types of soldering methods:
1) Infrared reflow
2) Convection reflow
3) Infrared convection combined
4) VPS (Vapor Phase Soldering)
5) flow (wave) soldering
[Feature] Because of excellence in productivity and running cost, these types are widely used.
However, this method can place considerable heat stress on the semiconductor device and board.

Select the soldering method best suited to your application by take into consideration the advantages and disadvantages of each soldering method, as well as the heat resistance of the SMD.
The features of the respective methods are compared in Table 1-1-1 (next page).

To CHAPTER 1 SOLDERING GENERALTo 1.1.2 Features of soldering method