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Packages
The functions of semiconductor devices produced by NEC Electronics' leading-edge technology are built into silicon chips through complex processes. Packages not only protect silicon chips, they also maximize the functions to their fullest extent.
NEC Electronics provides a wide variety of reliable and performance-proven package solutions which contribute to the sophistication of customers' products under development.
Basics of Packaging
The links below provide a comprehensible explanation of package functions and architectures, and act as references for the package lineup of NEC Electronics and development trends.
For customers considering introduction
NEC electronics offers a wide lineup of package products for ICs, including microcontrollers, transistors, and discrete devices. The lineup can be viewed from the links below.
For engineers designing and developing application products
The links below provide various information required when using NEC Electronics semiconductor devices for product development. The contents consist mainly of information related to package drawings, thermal characteristics, electrical characteristics, packing and mounting of IC packages.
Site Updates
- List of IC packages has been updated. (2007/10/5)
- The package Web site has been updated.(2007/1/10)
