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Products > Packages >

List of IC packages


Click the package name to display a list.
From this list you can display outline drawings, photographs, land patterns, and packing drawings. Note, however, that packing specifications may differ depending on where the assembly and testing factory. If you can't find the product you are looking for, please check with your NEC Electronics sales representative.


SMD type
Area array type BGA
(Ball Grid Array Package)		 P-BGA
(Plastic BGA)
P-FBGA
(Plastic Fine Pitch BGA)
LGA
(Land Grid Array Package) 		LGA
(Plastic Fine Pitch LGA)
Peripheral type QFP
(Quad Flat Package) 		P-QFP
(Plastic QFP)
P-QFP(FP)
(Plastic QFP(Fine Pitch))
QFN
(Quad Flat Non-leaded
Package)		 P-QFN
(Plastic QFN)
SOP
(Small Outline Package)		 P-SOP
(Plastic SOP)
P-SSOP
(Plastic Shrink SOP)
P-TSOP(1)
(Plastic Thin SOP Type1)
P-TSOP(2)
(Plastic Thin SOP Type2)
SOJ
(Small Outline J-leaded Package)		 P-SOJ
(Plastic SOJ)
THD type
  DIP
(Dual Inline Package)		 P-DIP
(Plastic DIP)
P-SDIP
(Plastic Shrink DIP)
SIP
(Singl Inline Package)		 P-SIP
(Plastic SIP)
ZIP
(Zigzag Inline Package)		 P-ZIP
(Plastic ZIP)
V-DIP
(Vertical Dual Inline Package)		 P-VDIP
(Plastic VDIP)
PGA
(Pin Grid Array Package)		 P-PGA
(Plastic PGA)