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P-DIP, P-SDIP

Detailed information on package drawings, photos, land patterns, container drawings, and packing drawings can be checked with PDF documents.

8 pin | 14 pin | 16 pin | 18 pin | 20 pin | 22 pin | 24 pin | 28 pin | 30 pin | 32 pin |

36 pin | 40 pin | 42 pin | 48 pin | 64 pin

Package									Packing						Remarks
Pin Count	Nominal Dimensions	NEC Code	JEITA Code	Lead Pitch	Package Height	Mass (Reference value)	Photo	Land pattern	Tube		Embossed Tape		Tray
									Container	Packing	Container	Packing	Container	Packing
8	7.62mm(300)	P8C-100-300A-2	P-DIP8-0300-2.54	2.54		0.48 g			H5229-2, H6701-1	H5231-2, H5403-5					Short lead
8	7.62mm(300)	P8C-100-300B,C-2	P-DIP8-0300-2.54	2.54		0.48 g			H5229-2, H6701-1	H5231-2, H5403-5
8	7.62mm(300)	P8CT-100-300B2-2	P-DIP8-0300-2.54	2.54		0.82 g			H6521						With tab
14	10.16mm(400)	P14C-100-400A-2	P-DIP14-0400-2.54	2.54		1.3 g			H6525-1	H5261-2
14	7.62mm(300)	P14C-100-300A,C-2	P-DIP14-0300-2.54	2.54		0.93 g			H6041-1, H6701-1	H5403-5, H6043-1
14	7.62mm(300)	P14C-100-300B1-3	P-DIP14-0300-2.54	2.54		0.93 g			H6041-1, H6701-1	H5403-5, H6043-1
14	7.62mm(300)	P14C-100-300B2-2	P-DIP14-0300-2.54	2.54		0.93 g			H6041-1, H6701-1	H5403-5, H6043-1
14	7.62mm(300)	P14C-70-300B-2	P-SDIP14-0300-1.78	1.778					H6701-1	H5403-5					Shrink
14	7.62mm(300)	P14CT-100-300B-2	P-DIP14-0300-2.54	2.54		1.3 g			H6527-1						With tab
16	7.62mm(300)	P16C-100-300A,C-2	P-DIP16-0300-2.54	2.54		1.2 g			H6041-1, H6701-1	H6043-1
16	7.62mm(300)	P16C-100-300B-2	P-DIP16-0300-2.54	2.54		1.2 g			H6041-1, H6701-1	H6043-1
16	7.62mm(300)	P16C-100-300SA-2	P-DIP16-0300-2.54	2.54		1.2 g									Semi-wide body
16	7.62mm(300)	P16C-100-300WA-2	P-DIP16-0300-2.54	2.54		1.2 g									Wide body
16	7.62mm(300)	P16CS-70-CAB	P-SDIP16-0300-1.78	1.778											Shrink
16	7.62mm(300)	P16CT-100-300B-2	P-DIP16-0300-2.54	2.54		1.3 g			H6527-1						With tab
18	7.62mm(300)	P18C-100-300A,C-2	P-DIP18-0300-2.54	2.54		1.3 g			H5229-2, H6701-1	H5403-5, H5707-2
18	7.62mm(300)	P18C-100-300B-3	P-DIP18-0300-2.54	2.54		1.3 g			H5229-2, H6701-1	H5403-5, H5707-2
18	7.62mm(300)	P18C-100-300SA-2	P-DIP18-0300-2.54	2.54		1.3 g									Semi-wide body
18	7.62mm(300)	P18C-100-300WA1-2	P-DIP18-0300-2.54	2.54		1.3 g									Wide body (Half shoulder)
18	7.62mm(300)	P18C-100-300WA-2	P-DIP18-0300-2.54	2.54		1.3 g									Wide body
18	7.62mm(300)	P18C-70-300B-2	P-SDIP18-0300-1.78	1.778		0.93 g			H6701-1	H5403-5					Shrink
20	10.16mm(400)	P20C-100-400A,C-2	P-DIP20-0400-2.54	2.54		2.2 g			H5361-1, H6525-1	H5261-2, H6703
20	10.16mm(400)	P20C-100-400B-2	P-DIP20-0400-2.54	2.54		2.1 g			H5361-1, H6525-1	H5261-2, H6703
20	7.62mm(300)	P20C-100-300A,C-2	P-DIP20-0300-2.54	2.54		1.3 g			H5229-2, H6701-1	H5707-2, H5823-1
20	7.62mm(300)	P20C-100-300SA-1	P-DIP20-0300-2.54	2.54		1.3 g									Semi-wide body
20	7.62mm(300)	P20C-100-300WA-2	P-DIP20-0300-2.54	2.54		1.3 g									Wide body
20	7.62mm(300)	P20C-70-300B-2	P-SDIP20-0300-1.78	1.778		0.95 g			H6701-1	H5403-5					Shrink
20	7.62mm(300)	P20CS-70-CAC	P-SDIP20-0300-1.78	1.778											Shrink
22	10.16mm(400)	P22C-100-400A-2	P-DIP22-0400-2.54	2.54		2.4 g			H5361-1, H6525-1	H5261-2, H6703
22	10.16mm(400)	P22C-100-400B-2	P-DIP22-0400-2.54	2.54		2.4 g			H5361-1, H6525-1	H5261-2, H6703
22	7.62mm(300)	P22C-100-300WA-2	P-DIP22-0300-2.54	2.54		1.5 g									Wide body
22	7.62mm(300)	S22C-70-300B-2	P-SDIP22-0300-1.78	1.778		1.2 g			H6701-1	H5403-5					Shrink
24	10.16mm(400)	P24C-100-400A1-2	P-DIP24-0400-2.54	2.54		2.6 g			H6525-1	H5261-2
24	15.24mm(600)	P24C-100-600-2	P-DIP24-0600-2.54	2.54		3.6 g			H5171-3	H5975
24	15.24mm(600)	P24C-100-600A2-2	P-DIP24-0600-2.54	2.54		3.6 g			H5171-3	H5975
24	7.62mm(300)	P24C-100-300A-2	P-DIP24-0300-2.54	2.54		1.6 g			H5229-2	H5707-2
24	7.62mm(300)	P24C-100-300WA-2	P-DIP24-0300-2.54	2.54		1.7 g									Wide body
24	7.62mm(300)	S24C-70-300B-3	P-SDIP24-0300-1.78	1.778		1.2 g			H6701-1	H5403-5					Shrink
28	10.16mm(400)	P28C-100-400-2	P-DIP28-0400-2.54	2.54		2.8 g			H6525-1	H5261-2
28	10.16mm(400)	P28C-70-400A-2	P-SDIP28-0400-1.78	1.778		2.1 g			H5361-1, H6525-1	H6703					Shrink
28	10.16mm(400)	S28C-70-400B-2	P-SDIP28-0400-1.78	1.778		2.1 g			H5361-1, H6525-1	H6703					Shrink
28	15.24mm(600)	P28C-100-600A1-2	P-DIP28-0600-2.54	2.54		4.1 g			H5171-3, H5333-3	H5331-2, H5975
28	15.24mm(600)	P28C-100-600A2-2	P-DIP28-0600-2.54	2.54		4.1 g			H5171-3, H5333-3	H5331-2, H5975
28	15.24mm(600)	P28C-100-600B-2	P-DIP28-0600-2.54	2.54		4.1 g			H5171-3, H5333-3	H5331-2, H5975
28	7.62mm(300)	P28C-100-300SA-2	P-DIP28-0300-2.54	2.54		2.0 g									Semi-wide body
28	7.62mm(300)	P28C-100-300WA-2	P-DIP28-0300-2.54	2.54		2.1 g									Wide body
30	10.16mm(400)	S30C-70-400B-3	P-SDIP30-0400-1.78	1.778		2.1 g			H5361-1	H6703					Shrink
32	10.16mm(400)	P32CT-70-DAA	P-SDIP32-0400-1.78	1.778		2.1 g									Shrink
32	15.24mm(600)	P32C-100-600A-2	P-DIP32-0600-2.54	2.54		4.4 g			H5333-3	H5331-2
32	7.62mm(300)	P32C-100-300WA-2	P-DIP32-0300-2.54	2.54		2.5 g									Wide body
32	7.62mm(300)	P32CS-70-CAA	P-SDIP32-0300-1.78	1.778											Shrink
36	15.24mm(600)	P36CZ-100-600A-1	P-DIP36-0600-2.54	2.54		4.7 g			H5333-3	H5331-2
40	15.24mm(600)	P40C-100-600A1-2	P-DIP40-0600-2.54	2.54		6.1 g			H5333-3	H5331-2
40	15.24mm(600)	P40C-100-600A-2	P-DIP40-0600-2.54	2.54		6.1 g			H5333-3	H5331-2
40	15.24mm(600)	P40C-70-600A-2	P-SDIP40-0600-1.78	1.778		4.2 g			H5333-3	H5331-2					Shrink
42	15.24mm(600)	P42C-100-600A,B-2	P-DIP42-0600-2.54	2.54		6.3 g			H5171-3, H5333-3	H5331-2, H5975
42	15.24mm(600)	P42C-70-600A-2	P-SDIP42-0600-1.78	1.778		4.4 g			H5171-3, H5333-3	H5331-2, H5975					Shrink
42	15.24mm(600)	P42C-70-600B-2	P-SDIP42-0600-1.78	1.778		4.4 g			H5171-3, H5333-3	H5331-2, H5975					Shrink
48	15.24mm(600)	P48C-100-600A-2	P-DIP48-0600-2.54	2.54		7.2 g			H5333-3	H5331-2
48	15.24mm(600)	P48C-70-600B-2	P-SDIP48-0600-1.78	1.778		5.0 g			H5171-3	H5975					Shrink
64	19.05mm(750)	P64C-70-750A,C-4	P-SDIP64-0750-1.78	1.778		8.3 g			H5109-2	H5111-2					Shrink

AdvancedParametric

Packages

• Basics of Packaging
  • Package Variations (IC)
  • Package Variations (Discrete)
• Trends in package development
  • SMAFTI
  • SiP
  • FCBGA
  • CSP
• List of IC packages
  • P-BGA
  • P-FBGA
  • LGA
  • P-QFP
  • P-QFP (FP)
  • P-QFN
  • P-SOP
  • P-SSOP
  • P-TSOP (1)
  • P-TSOP (2)
  • P-SOJ
  • P-DIP, P-SDIP
  • P-SIP
  • P-ZIP
  • P-VDIP
  • P-PGA
  • P-BGA
  • P-FBGA
  • LGA
  • P-QFP
  • P-QFP (FP)
  • P-QFN
  • P-SOP
  • P-SSOP
  • P-TSOP (1)
  • P-TSOP (2)
  • P-SOJ
  • P-DIP, P-SDIP
  • P-SIP
  • P-ZIP
  • P-VDIP
  • P-PGA
• List of Discrete packages
• Outline drawing information
  • System of outline drawing codes for
    IC packages
  • BGA outline drawing codes
  • QFP outline drawing codes
  • SOP outline drawing codes
  • DIP outline drawing codes
  • Reference symbols and dimension examples for BGA
  • Reference symbols and dimension examples for QFP
  • Reference symbols and dimension examples for SOP
  • Reference symbols and dimension examples for DIP
  • Parallelism y1
  • Terminal coplanarity y
  • Tolerance of terminal center position x
  • Tolerance of the center position of package w
• Thermal and electrical characteristics
  • Mechanism of heat dissipation
  • Four major influential factors in thermal
    resistance
  • Thermal design of a package
  • Thermal characteristics
  • Classification of electrical noise
  • Different electrical requirements for different applications
  • Package electrical characteristics
  • Electrical characteristics
• Packing of IC packages
  • Outline
  • Details
• Semiconductor Device Mount Manual
  • SOLDERING GENERAL
  • PRINTED WIRING BOARD DESIGN
  • SOLDERING CONDITIONS
  • NOTES ON MOUNTING
  • SOLDER JOINT RELIABILITY
  • APPENDIX
• Links to relevant sites