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Package electrical characteristics

Target functions, applications, systems, and market prices drive semiconductor device design. Selecting the best package for a given design concept requires a thorough understanding of the electrical characteristics, advantages, and disadvantages of each package. The electrical characteristics of the package types are summarized below.

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Comparison of electrical characteristics of various packages

	FBGA	PBGA (cavity up)	ABGA (cavity down)	FCBGA
Shape	Enlarged image	Enlarged image	Enlarged image	Enlarged image
Features	PBGA with a ball pitch of less than 1mm. Although this type of package does not provide characteristic impedance matching, it has the advantages of short wiring length and good electrical characteristics, as well as the lowest unit price of all the listed packages.	The ball pitch of this package is 1mm or more, allowing the use of inexpensive package substrates. This package is widely used for consumer electronic systems. It allows highly flexible substrate design, is the lowest in price after FBGAs, and has good electrical characteristics.	ABGAs have low thermal resistance and can accommodate devices of up to 10W with forced air cooling.	This package has the least parasitic impedance because the connection distance between the chip and substrate is the shortest. Stable power design and characteristics impedance matching are achieved by establishing a power ground plane. The electrical characteristics and thermal characteristics of this package are best in class.
Disadvantages	Due to its small pitch, this package requires an expensive high-density package substrate such as a build-up PWB. Another disadvantage of FBGAs is their high thermal resistance.	PBGAs boast the highest thermal resistance after FBGAs and can accommodate devices of up to about 3W.	Relatively long wire length and limited external transfer frequency.	Currently, the most costly of all the packages listed here.
Suitable applications	Small mobile systems for which an expensive package substrate can be used.	Consumer electronic systems.	Suitable for products with a relatively high power consumption and large bus width. This package is used when high performance is required but not to the point of requiring FCBGA.	Communication trunk line systems, MPUs, servers.
Cautions	Not suitable for products with a high power consumption, because the thermal resistance is relatively high.		The recommended maximum number of package substrate layers is 4, beyond which the price sharply increases.	Special design is required for area array pins on chips. Efforts are being made to bring down the cost of this type of package to the same level as that of PBGAs in the future.

Experience in electrical/thermal design and mass production
NEC Electronics has a vast store of accumulated knowledge and experience in the mass production of IC packages with state-of-the-art electrical and thermal characteristics including those listed below. Our goal moving forward is to push the envelope and mass produce products with ever higher characteristics.

	Product Device	Ball Count	Signal	Frequency	Channel Bus	Band Width	Power
PBGA	HDD Controller	388	LVDS	1.5GHz	8ch	3.0GBps	2W
	Server North Bridge	609	LVDS	200MHz (clock) 800MHz (MAX)	32bit	6.4GBps	2.5W
	Server PCI bus	320	DDR	266MHz (clock) 533MHz (MAX)	32bit	4.3GBps	2W
ABGA	SDH	756	LVDS HAGAR	160MHz(clock) 1.25GHz(MAX)	36	11.3GBps	13W
	Game	500	DDR	162MHz	64	2.6GBps	10.5W
	Transponder	672	LVDS	166MHz (clock) 333MHz (MAX)	15	1.3GBps	4.3W
FCBGA	Switch	1155	-	156MHz(clock) 1.56GHz(MAX)	205	80GBps	18W
	Switch	1849	-	250MHz(clock) 333MHz(MAX)	384	16GBps	25W
	Server North Bridge	729	-	400MHz(clock) 800MHz(MAX)	32	3.2GBps	3.2W

Electrical characteristics

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