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Thermal and electrical characteristics


The constant pressure to develop new and improved electronics equipment drives innovation in semiconductor devices. Thermal management and electrical integrity are two key issues that must be addressed in order to meet customer demand for higher performance, smaller packaging, lower power consumption, and lower cost. Semiconductor packages must be designed to meet these demands as well.

Thermal management   Electrical integrity
Mechanism of heat dissipation   Classification of electrical noise
Four major influential factors in thermal resistance   Different electrical requirements for different applications
Thermal package design   Electrical characteristics of each package

Thermal and electrical characteristics of semiconductor packages