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Products > Packages > Thermal and electrical characteristics > Thermal characteristics >

SOP


Thermal characteristics

1  

All values are calculated by simulating the test method using a wind tunnel according to the SEMI standard. Air velocity of 0 m/s represents natural convection under still air in the wind tunnel specified in the SEMI standard.
2 Thermal characteristics are affected by environmental conditions such as the density of the copper pattern on the test board, etc.

Type Pin
count		 PKG
size[mm]		 Die
size[mm]		 Thermal
Test Board
Layers		 θja(°c/w)
0m/s 1m/s 2m/s
SOP 8 5.0x4.4 2.28x1.97 2

217

 - -
SOP 8 5.2x4.4 1.43x1.42 4 216 - -
SOP 14 10.2x4.4 2.06x1.65 4 149 - -
SOP 16 10x7.15 4.22x2.97 2 90 - -
SOP 16 10x7.15 4.22x2.97 4 83 - -
SOP 20 12.5x7.2 4.5x4.5 2 49 39 34
SSOP 16 5.0x4.4 2.28x1.97 2 165 - -
SSOP 20 6.5x6.1 1.44x1.16 2 157 - -
SSOP 20 6.5x6.1 2.59x2.07 2 132 - -
SSOP 24 8.21x6.1 2.01x1.8 4 111 - -
SSOP 30 9.7x6.1 1.574x1.564 2 115 - -
SSOP 30 9.7x6.1 2.18x1.7 2 114 101 -
SSOP 30 9.7x6.1 2.06x2.03 2 112 - -
SSOP 30 9.7x6.1 3.8x3.59 2 110 71 67
SSOP 30 9.7x6.1 4.38x2.44 2 98 - -
SSOP 30 9.7x6.1 6.4x3.5 2 85 - -
SSOP 38 12.3x6.1 2.40x2.01 4 71 - -
SSOP 38 12.3x6.1 6.75x3.39 4 65 - -
SSOP 48 15.8x8 4.9x4.6 2 72 - -
TSSOP 8 4.4x3.1 1.09x1.03 4 221 - -
TSSOP 14 5.2x4.4 1.40x1.23 4 167 - -
TSSOP 26 6.5x6.1 3.6x3.09 4 118 - -