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PBGA


Thermal characteristics

1  

All values are calculated by simulating the test method using a wind tunnel according to the JEDEC standard. Air velocity of 0 m/s represents natural convection under still air in the wind tunnel specified in the JEDEC standard.
2 Thermal characteristics are affected by environmental conditions such as the density of the copper pattern on the test board, etc.

Gang Mold Type
Ball count Thermal
Ball		 PKG size
[mm]		 Die size
[mm]		 PKG
Substrate
layer		 Test Board
Layers		 0m/s 1m/s 2m/s θjc
(°c/w)
θja
(°c/w)		 Ψjt
(°c/w)		 θja
(°c/w)		 Ψjt
(°c/w)		 θja
(°c/w)		 Ψjt
(°c/w)
256 full 17x17 4.85x4.85 2L 4 25 0.19 21 0.45 20 0.57 9.5
256 full 17x17 8.0x8.0 2L 4 20 0.05 15 0.25 14 0.33 5.1
256 full 17x17 10.85x10.85 2L 4 18 0.03 13 0.22 12 0.29 3.5
256 full 17x17 4.85x4.85 4L 4 24 0.17 20 0.41 18 0.53 8.6
256 full 17x17 8.0x8.0 4L 4 19 0.05 15 0.23 14 0.31 4.8
256 full 17x17 10.85x10.85 4L 4 18 0.02 13 0.20 12 0.27 3.3
256 - 21x21 4.85x4.85 2L 4 35 0.24 29 0.59 28 0.76 9.2
256 - 21x21 8.0x8.0 2L 4 28 0.10 23 0.35 21 0.48 5.0
256 - 21x21 10.85x10.85 2L 4 24 0.07 19 0.28 18 0.38 3.4
256 - 21x21 4.85x4.85 4L 4 30 0.20 25 0.48 23 0.63 8.3
256 - 21x21 8.0x8.0 4L 4 24 0.08 19 0.29 18 0.39 4.5
256 - 21x21 10.85x10.85 4L 4 22 0.05 17 0.23 15 0.32 3.1
404 8x8 23x23 4.85x4.85 2L 4 24 0.19 20 0.41 18 0.53 8.9
404 8x8 23x23 8.0x8.0 2L 4 19 0.05 15 0.21 13 0.29 4.9
404 8x8 23x23 10.85x10.85 2L 4 17 0.02 12 0.18 11 0.24 3.3
404 8x8 23x23 4.85x4.85 4L 4 22 0.17 18 0.38 17 0.48 8.0
404 8x8 23x23 8.0x8.0 4L 4 18 0.05 14 0.20 12 0.27 4.4
404 8x8 23x23 10.85x10.85 4L 4 16 0.02 12 0.16 11 0.22 3.0
484 full 23x23 4.85x4.85 2L 4 23 0.19 19 0.40 18 0.51 8.2
484 full 23x23 8.0x8.0 2L 4 18 0.06 14 0.21 13 0.29 4.6
484 full 23x23 10.85x10.85 2L 4 17 0.03 12 0.16 11 0.23 3.1
484 full 23x23 4.85x4.85 4L 4 22 0.17 18 0.38 17 0.47 7.6
484 full 23x23 8.0x8.0 4L 4 18 0.05 13 0.20 12 0.27 4.2
484 full 23x23 10.85x10.85 4L 4 16 0.02 12 0.15 11 0.21 2.9


Individual Mold Type
Ball count Thermal
Ball		 PKG size
[mm]		 Die size
[mm]		 PKG
Substrate
layer		 Test Board
Layers		 0m/s 1m/s 2m/s θjc
(°c/w)
θja
(°c/w)		 Ψjt
(°c/w)		 θja
(°c/w)		 Ψjt
(°c/w)		 θja
(°c/w)		 Ψjt
(°c/w)
256 - 27x27 4.85x4.85 2L 4 34 0.37 28 0.78 27 0.99 10.5
256 - 27x27 8.0x8.0 2L 4 27 0.13 22 0.44 20 0.59 5.9
256 - 27x27 10.85x10.85 2L 4 23 0.08 18 0.33 16 0.46 4.0
256 - 27x27 4.85x4.85 4L 4 28 0.30 23 0.63 21 0.79 9.2
256 - 27x27 8.0x8.0 4L 4 22 0.10 17 0.34 16 0.46 5.2
256 - 27x27 10.85x10.85 4L 4 20 0.06 15 0.26 13 0.36 3.6
544 8x8 27x27 4.85x4.85 2L 4 23 0.27 18 0.53 17 0.66 9.5
544 8x8 27x27 8.0x8.0 2L 4 18 0.07 14 0.27 13 0.36 5.5
544 8x8 27x27 10.85x10.85 2L 4 16 0.03 12 0.21 11 0.28 3.8
544 8x8 27x27 4.85x4.85 4L 4 21 0.25 17 0.49 16 0.61 8.5
544 8x8 27x27 8.0x8.0 4L 4 17 0.07 13 0.25 12 0.33 4.9
544 8x8 27x27 10.85x10.85 4L 4 15 0.03 11 0.19 10 0.26 3.5
352 - 35x35 4.85x4.85 2L 4 34 0.36 29 0.76 27 0.96 10.2
352 - 35x35 8.0x8.0 2L 4 26 0.13 21 0.41 20 0.55 5.7
352 - 35x35 10.85x10.85 2L 4 23 0.08 18 0.31 16 0.42 3.8
352 - 35x35 4.85x4.85 4L 4 27 0.29 22 0.59 21 0.74 8.8
352 - 35x35 8.0x8.0 4L 4 23 0.09 16 0.31 15 0.41 4.9
352 - 35x35 10.85x10.85 4L 4 19 0.06 14 0.23 13 0.32 3.4
388 6x6 35x35 4.85x4.85 2L 4 23 0.27 19 0.53 18 0.66 9.8
388 6x6 35x35 8.0x8.0 2L 4 18 0.07 14 0.26 13 0.35 5.7
388 6x6 35x35 10.85x10.85 2L 4 16 0.03 12 0.21 11 0.28 3.9
388 6x6 35x35 4.85x4.85 4L 4 21 0.25 17 0.48 16 0.60 8.6
388 6x6 35x35 8.0x8.0 4L 4 17 0.06 13 0.23 12 0.31 4.9
388 6x6 35x35 10.85x10.85 4L 4 15 0.03 11 0.17 10 0.24 3.4
544 8x8 35x35 4.85x4.85 4L 4 21 0.25 16 0.47 15 0.58 8.3
544 8x8 35x35 8.0x8.0 4L 4 16 0.07 12 0.23 11 0.30 4.7
544 8x8 35x35 10.85x10.85 4L 4 15 0.03 10 0.17 9 0.23 3.4
797 9x9 35x35 4.85x4.85 4L 4 20 0.24 16 0.46 15 0.57 7.9
797 9x9 35x35 8.0x8.0 4L 4 16 0.06 12 0.22 11 0.30 4.6
797 9x9 35x35 10.85x10.85 4L 4 15 0.03 10 0.17 9 0.23 3.3

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