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FCBGA
| Thermal characteristics |
| 1 |
|
|
| 2 | Thermal characteristics are affected by environmental conditions such as the density of the copper pattern on the test board, etc. |
| Ball count | PKG size[mm] | Die size[mm] | PKG Substrate Layers |
Thermal Test Board Layers |
θja(°c/w) | ||
|---|---|---|---|---|---|---|---|
| 0m/s | 1m/s | 2m/s | |||||
| 324 | 19x19 | 8x8 | 7 | 4 | 32 | 25 | 23 |
| 400 | 21x21 | 8x8 | 7 | 4 | 31 | 24 | 22 |
| 484 | 21x21 | 8x8 | 7 | 4 | 30 | 24 | 22 |
| 655 | 24.5x19.5 | 5x5 | 6 | 4 | 25 | 19 | 17 |
| 729 | 29x29 | 7.07x7.07 | 6 | 4 | 25 | 19 | 17 |
| 955 | 33x33 | 13.57x13.57 | 7 | 4 | 14 | - | - |
| 1155 | 35x35 | 12.52x12.52 | 7 | 4 | 14 | 9 | 7 |
| 1521 | 40x40 | 12x12 | 6 | 4 | 14 | 9 | 8 |
| 1521 | 40x40 | 17.5x17.5 | 8 | 4 | 13 | 8 | 6 |
| 1849 | 45x45 | 14x14 | 6 | 4 | 12 | 8 | 7 |
| 1849 | 45x45 | 17.27x17.27 | 7 | 4 | 10 | 6 | 5 |
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