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Products > Packages > Thermal and electrical characteristics > Thermal characteristics >

ABGA


Thermal characteristics

1  

All values are calculated by simulating the test method using a wind tunnel according to the SEMI standard. Air velocity of 0 m/s represents natural convection under still air in the wind tunnel specified in the SEMI standard.
2 Thermal characteristics are affected by environmental conditions such as the density of the copper pattern on the test board, etc.

Ball count PKG size[mm] Die size[mm] PKG Substrate
Layers		 Thermal
Test Board
Layers		 θja(°c/w)
0m/s 1m/s 2m/s
256 27x27 5.27x5.27 4 layer 4 20 14 12
256 27x27 7.67x7.67 4 layer 4 19 13 11
272 29x29 7.43x7.05 2 layer 4 17 13 11
352 35x35 6.47x6.47 4 layer 4 16 11 9
352 35x35 10.12x10.12 4 layer 4 15 10 8
416 40x40 8.47x8.47 7 layer 4 16 10 8
416 40x40 10.12x10.12 7 layer 4 16 10 8
420 35x35 7.27x7.27 4 layer 4 15 10 9
420 35x35 8.07x8.07 4 layer 4 16 10 9
420 35x35 10.12x10.12 4 layer 4 15 10 8
480 45x45 9.32x9.32 7 layer 4 14 9 7
480 45x45 10.12x10.12 7 layer 4 14 9 7
500 40x40 10.12x10.12 4 layer 4 14 9 7
500 40x40 10.12x10.12 7 layer 4 15 9 8
576 40x40 11x11 6 layer 8 12 7 -
576 40x40 11x11 7 layer 8 14 9 -
672 45x45 12.02x12.02 7 layer 4 13 8 7
672 45x45 12.02x12.02 7 layer 8 13 7 -
756 45x45 14.9x14.9 2 layer 4 12 7 6
756 45x45 17.5x17.5 2 layer 4 12 7 6
888 45x45 17.5x17.5 7 layer 4 13 8 6