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Lead-Free Specification of Package Pins

The following lead-free specifications apply when these main packages are externally processed.

Surface-mount type (SMD)

Package Lead-free specification Name Appearance Sn-Bi plating Matte Sn plating Ni/Pd/Au plating Sn-Ag-Cu dip Sn-Ag-Cu ball Ni/Au plating QFP TQFP LQFP         SOP TSOP I TSOP II       SOJ           BGA           LGA           Mini-mold (transistors, diodes)

: Lead-free specification, : Same as plating specifications of existing package.

Note(*)

1. Limited to specific packages

Through-hole type (THD)

Package Lead-free specification Name Appearance Sn-Bi plating Matte Sn plating Ni/Pd/Au plating Sn-Ag-Cu dip Sn-Ag-Cu ball Ni/Au plating DIP         ZIP           Radial type (transistors)

: Lead-free specification, : Same as plating specifications of existing package.

Note(*)

1. Limited to specific packages

Lead (Pb)-free
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