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Notes on Soldering Temperature Profile
It is recommended that the soldering temperature profile be set between the temperature recommended by the maker of the solder paste being used and the temperature range of the product’s recommended soldering conditions (the shaded area in the following figure). Reflow that exceeds the recommended soldering conditions invites lowered product reliability and mounting outside the paste maker’s recommended temperature range makes it possible for soldering defects such as insufficient flux activity or unmelted solder to occur.
