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Products > Lead (Pb)-free Information > Solder Joint Reliability >

Lead-type SMD

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Solder wettability

Test method: Wetting balance method (IPC/EIA/JEDEC J-STD-002B) Solder bus: 245°C/Sn-3Ag-0.5Cu, 235°C/Sn-37Pb Pre-conditioning: PCT4h

Lead pull strength

Test conditions: TA = -40 to 125°C/10 minutes each (min.) Soldering temperature: 245°C/Sn-3Ag-0.5Cu paste, 220°C/Sn-37Pb paste

Temperature cycle life

Test conditions: TA = -40 to 125°C/10 minutes each (min.) Soldering temperature: 245°C/Sn-3Ag-0.5Cu paste, 220°C/Sn-37Pb paste Failure definition: 20% increase in nominal resistance

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