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Soldering with Leaded Solder
Care is needed when soldering a lead-free product using a solder containing lead, such as Sn-Pb eutectic solder.
For example, if a BGA type product, in which Sn-3Ag-0.5Cu balls (melting point: 217 to 220°C) are used, soldered with Sn-Pb eutectic solder (melting point: 183°C) below the melting point of the solder balls, the solder paste melts but the solder balls do not completely melt. In this case, adequate reliability of the solder joint is not obtained, and at the same time, a product may be mounted too high due to insufficient solder ball melting.
Solder Joint Status
