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Products > Lead (Pb)-free Information > Lead-Free Semiconductor Products >

Eliminating Lead

Pins

Type Conventional products Lead-free products Surface-mount type (SMD) Sn-Pb plating — Ni/Au plating Sn-Pb ball Sn-Bi plating,Matte Sn plating Ni/Pd/Au plating Ni/Au plating (Same as at present) Sn-Ag-Cu ball Through-hole type (THD) Sn-Pb plating Ni/Au plating Sn-Pb dip Sn-Bi plating,Matte Sn plating Ni/Au plating (Same as at present) Sn-Ag-Cu dip

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Lead (Pb)-free
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• Environmental
  Activities of
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• Lead-Free
  Semiconductor
  Products
  • Lead-Free
    and EU RoHS Directive
  • Areas Where Lead Is
    to Be Eliminated
  • Representative
    Materials and
    Characteristics
  • Eliminating Lead
  • Lead-Free
    and EU RoHS Directive
  • Areas Where Lead Is
    to Be Eliminated
  • Representative
    Materials and
    Characteristics
  • Eliminating Lead
• Compliance with
  China RoHS
• List of Products
  Complying with the
  China RoHS
• Lead-Free
  Specification
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• Identification of
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• Recommended
  Soldering Conditions
• Notes and Precautions
  on Soldering
  Lead-Free Products
  • Notes on Soldering
    Temperature Profile
  • Soldering with Leaded
    Solder
  • Appearance of
    Lead-Free BGA
    Solder Balls
  • Cross Section of
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    After Soldering
• Solder Joint
  Reliability
  • Lead-type SMD
  • BGA-type SMD
• Lead-free Product List
  (PDF:285KB)
• Lead (Pb)-free Semiconductor Products of Opto-Electronics, and RF and Microwave Devices
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