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Products > Lead (Pb)-free Information >

Lead (Pb)-free Semiconductor Products of Opto-Electronics, and RF and Microwave Devices



Lead (Pb)-free Policies
  • As a so-called "green vendor", NEC Electronics contributes to global environmental protection by actively promoting the introduction of Lead (Pb)-free products as part of our ongoing efforts to develop and supply environmentally sound products.
  • We have completed development of Lead (Pb)-free technology for all of our opto-electronics, RF, and microwave products*1 and are accepting orders for Lead (Pb)-free products.
  • Moreover, our future products will all be Lead (Pb)-free.
  • In consideration of the environment, we are aiming to completely eliminate the use of lead*2 in all of our opto-electronics, RF, and microwave products*1 by the end of September 2006 and have been progressing with the gradual switchover*3 since October 2005.

*1:Products made by the former NEC Compound Semiconductor Devices, Ltd.
*2:RoHS compliant (Some products will still have internal parts with material containing lead.) Contact a sales representative for details. Regarding the China RoHS, click here.
*3:Except for maintenance products being phased out.


Measures for Lead (Pb)-free Implementation


1. Areas Requiring Lead (Pb)-free
Areas Requiring Pb-Free Mounting materials such as soldering paste and soft solder
(Modules and some power devices)
Solder plating of outer leads
(Plastic packages)

2. Method of Lead (Pb)-free Implementation
(1) Solder plating for outer leads
Conventional Products Lead (Pb)-free Products
Sn-Pb Sn-Bi*
Au Au
*: Solder dip products (radial transistors) use an Sn-Ag-Cu dip.
(2)Pb reduction inside packages
such as in the mounting materials, has already met the RoHS Directive requirements.
(Completely Lead (Pb)-free technologies are currently under development. Their actual implementation date is to be determined).


Lead (Pb)-free Specifications


Package Soldering of Outer Leads Mounting Materials Pb Usage in Other Areas
SOP type Sn-Bi plating* Pb not used Pb not used
DIP type Sn-Bi plating* Pb not used Pb not used
QFN type Sn-Bi plating* Pb not used Pb not used
MM type Sn-Bi plating* Pb not used Pb not used
Power mold Sn-Bi plating* Complies with RoHS
Complete Lead (Pb)-free
implementation underway
(Sn-Pb soft solder used)		 Pb not used
Radial type
(transistor)		 Sn-Ag-Cu dip* Pb not used Pb not used
Module type
(MCM)
(laser diode)		 Au plating
(Same as at present)		 Sn-Ag-Cu paste* Complies with RoHS
Complete Lead (Pb)-free
implementation underway
(Lead glass and ceramic parts, etc.)
Ceramic type and hollow plastic mold Au plating
(Same as at present)		 Pb not used Pb not used
*: The soldering of outer leads became Lead (Pb)-free in October, 2001. The Pb contained the packages met the RoHS Directive requirements in December, 2002.


Identification of Lead (Pb)-free Products*


Identification by marking on the product:
Lead (Pb)-free products will be marked with a dot-mark or alternative mark except for products using small packages such as minimold packages.
Dot-mark
Dot-mark for product marking

Identification by marking on the package label:
Package labels for all Lead (Pb)-free products will be marked with "Pb-Free T.".
Taping reel labels will also be marked in the same manner for taping at shipment.
* Note that this marking system applies only to products changed over to Lead (Pb)-free. Conventional products not containing Pb will not be marked.


Lead (Pb)-free Product Marking Method


= Compound/Si Microwave Devices =
Package Marking on Product Marking on Label
SOP type Dot-mark Lead (Pb)-free marking (logo)
on the label
(See the examples below.)
SSOP type** Dot-mark**
QFN type Underline
DIP type Dot-mark
TSSOP/HTSSOP No marking
TSON TYPE No marking
Minimold type No marking
Power mold No marking
TO-92 No marking
**: No marking for 175 mil 8-pin SSOP.


Example of Marking on Product Example of Marking
on Label
Display surface is marked with
a dot-mark or underline.
(E.g.) 8-pin SOP and QFN
(E.g.) 8-pin SOP       (E.g.) QFN

Packing label is marked with
the logo.



"Pb-Free T."
For details, please contact us.


= NEPOC Products (Photocouplers/OC MOS (Optical-coupled MOS)) =
Package Marking on Product Marking on Label
DIP (4, 6, 8 pins) Internal code

Lead (Pb)-free marking (logo)
on the inside label and outside label.


"Pb-Free T."
SOP 4PIN Laser printing Vertical line
Ink printing Italicized product name
OC MOS SOP 8PIN Internal code
SSOP 4PIN square mark Mark
SSOP 16PIN Laser printing Internal code
Ink printing Italicized product name
Flat lead Vertical line

Example of Marking on Product
DIP (4, 6, 8 pins)
DIP (4, 6, 8 pins)
Specified by the English-letter indicator at the 2nd digit of the internal code. 		SOP (laser printing)
SOP (laser printing)
Marked by a vertical line on the bottom-right corner.		 SSOP 4PIN
SSOP 4PIN
Stamped with the square mark mark.
For details, please contact us.



Recommended Soldering Conditions of Lead (Pb)-free Products


1. Surface Mount Type (SMD)
IR reflow with a peak temperature of 260°C
Wave soldering with molten solder in a 260°C soldering bath
Partial lead heating via a 350°C solder iron tip
2. Through Hole Type (THD)
Wave soldering with molten solder in a 260°C soldering bath
Partial lead heating via a 350°C solder iron tip
3. Hand Soldering Type
Partial lead heating via a 350°C solder iron tip

IR Reflow
(IR260)
Max. temperature (package surface temperature):
 260°C
Soldering time at max. temperature: Within 10 seconds
Soldering time at over 220°C: Within 60 seconds
Preheating time at 120°C - 180°C: 120 ± 30 seconds
Max. number of reflows: 3
Chlorine composition of rosin flux (%): 0.2% (wt.) or less


IR Reflow
Conditions for other than the above IR reflow mounting;
IR245 (Under preparation)
IR250-N1 (Under preparation)
IR260-D31/*-N2 (Under preparation)
IR260-D7/10 (Under preparation)
Wave Soldering
(WS260)
Max. temperature (molten solder temperature): 260°C
Flow time: Within 10 seconds
Preheat temperature (package surface temperature): Below 120°C
Number of flows: 1
Chlorine composition of rosin flux: 0.2% (wt.) or less

Partial Lead Heating (Hand Soldering)
(HS350/HS350-P3)
Max. temperature (outer lead temperature):
350°C
Time(per side of device***:HS350
       or per lead***:HS350-P3):		 Within 3 seconds
Chlorine composition of rosin flux: 0.2% (wt.) or less
***: Time is defined per side for SMD and per lead for THD)  

The conditions shown above are typical conditions, but specific conditions apply to certain products. Please contact one of our sales representatives for details.