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Recommended Soldering Conditions of Lead-Free Products
The recommended soldering conditions differ depending on the product, so please contact an NEC Electronics sales representative for details.
Through-Hole Type (THD)
The wave soldering conditions for molten solder with a temperature of 260°C or lower are set as follows.
- Maximum temperature (package surface temperature): 260°C or below
- Time at maximum temperature: 10 seconds or less
- Time with temperature higher than 220°C: 60 seconds or less
- Preheating temperature: 120°C or below
- Maximum number of reflow processes: 1
- Maximum chlorine content of rosin flux (percentage mass): 0.2% or less
Surface-Mount Type (SMD)
For reflow soldering conditions, two different peak temperatures of 250°C (max.) and of 260°C (max.) are specified (depending on package type). These are set to insure that devices can withstand mounting using Sn-Ag-Cu or other high melting point lead-free soldering methods. The figure below shows the temperature profile of each condition. The heat resistance of a surface-mount product, which is regulated by the package surface temperature, is set as the recommended soldering conditions for each product.
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