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Products > Lead (Pb)-free Information > Solder Joint Reliability >

BGA-type SMD

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Ball joint strength

Ball land diameter: 0.4 mm Ball diameter: φ0.5 mm Land structure: Cu/Ni/Au

Temperature cycle life

Test conditions: TA = -40 to 125°C/10 minutes each (min.) Soldering temperature: 250°C/Sn-Ag-Cu paste, 235°C/Sn-Pb paste Failure definition: 20% increase in nominal resistance

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