Please note that JavaScript and style sheet are used in this website,
Due to unadaptability of the style sheet with the browser used in your computer, pages may not look as original.
Even in such a case, however, the contents can be used safely.

SITE MAP  CONTACT US

Products > Lead (Pb)-free Information > Lead-Free Semiconductor Products >

Areas Where Lead Is to Be Eliminated

Lead will be eliminated from two general areas according to the package type: the external surface treatment of the leads, and the solder balls of BGAs.

Eliminating Pins

AdvancedParametric

Lead (Pb)-free
Information Home

• Environmental
  Activities of
  NEC Electronics
• Lead-Free
  Semiconductor
  Products
  • Lead-Free
    and EU RoHS Directive
  • Areas Where Lead Is
    to Be Eliminated
  • Representative
    Materials and
    Characteristics
  • Eliminating Lead
  • Lead-Free
    and EU RoHS Directive
  • Areas Where Lead Is
    to Be Eliminated
  • Representative
    Materials and
    Characteristics
  • Eliminating Lead
• Compliance with
  China RoHS
• List of Products
  Complying with the
  China RoHS
• Lead-Free
  Specification
  of Package Pins
• Identification of
  Lead-Free Products
• Recommended
  Soldering Conditions
• Notes and Precautions
  on Soldering
  Lead-Free Products
  • Notes on Soldering
    Temperature Profile
  • Soldering with Leaded
    Solder
  • Appearance of
    Lead-Free BGA
    Solder Balls
  • Cross Section of
    Solder Joints
    After Soldering
• Solder Joint
  Reliability
  • Lead-type SMD
  • BGA-type SMD
• Lead-free Product List
  (PDF:285KB)
• Lead (Pb)-free Semiconductor Products of Opto-Electronics, and RF and Microwave Devices
• FAQ