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Products > Opto-Electronics Devices > OCMOS FET > Package & Packing >

Photographs of OCMOS FETs (SSR: Solid State Relay)


Revised February 2004
Revised December 2003
September 2003
Clicking the following photograph shows switchable 4-direction photographs which you can zoom to the desired size.
photograph of 5 packages



  • Actual size print
  • The grid in the background of the photograph has squares of approximately 1 cm.
  • The images of detailed sections such as the pins may not be clear.
  • The dimensions of the photographs and values shown on this page are only approximate values and cannot be used for mounting design. When carrying out mounting design, be sure to use the values indicated in the individual package drawings.

Package types, typical dimensions and standard mass
(Clicking the package type on the following table shows the Package Dimensions.)
Caution: The values below differ slightly depending on the lead forming type.

Item (1) (2) (3) (4) (5) (6)
Package type 8-pin DIP 6-pin DIP 4-pin DIP 8-pin SOP 4-pin SOP 4-pin ultra-small
flat-lead
Width of molded body between pin lines (mm) 6.5 6.5 6.5 4.4 4.4 4.2
Length (mm) 9.25 9.25 9.25 9.08 4.0 2.5
Height (mm) 3.5 3.5 3.5 2.05 2.05 1.9
Mass (g) 0.5 0.5 0.5 0.19 0.08 0.04