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News & Event > News > By Category >

PRESS RELEASES (Partnership)
PRESS RELEASES (Partnership)
21 Feb 2008
Leading Optical Device Manufacturers Release Common Specifications for 40 Gbit/s Solutions Based on XLMD Optical Device Multi-Source Agreement
11 Dec 2007
NEC and NEC Electronics Develop Microcomputer and Operating System Platform for Next-generation Automotive Information Systems
27 Nov 2007
Toshiba and NEC Electronics Announce Joint Development of 32-nanometer System LSI Process Technology
7 July 2007
NEC Electronics and CCDT Introduce Turnkey Solution for Economical Set Top Boxes
26 Dec 2006
Memorandum of Agreement for Cooperation of Photomask Business
14 Dec 2006
Toshiba, Sony and NEC Electronics Unveil Mass Production Platform Technology for 45nm Generation High Performance System LSI
11 Dec 2006
Stacked Memory Packaging Technology Takes Mobile Memory Design to New Level
28 Nov 2006
NEC Electronics Announces Agreement with Trolltech to Integrate Linux Software with Medity Mobile Phone Chipset
6 Nov 2006
NEC Electronics, Skyley Networks, and UBEC Introduce Development Kits for ZigBee Wireless Peer-to-Peer Mesh Networking
21 Aug 2006
New Joint Venture "Adcore-Tech" Established to Develop Communications Platform for Mobile Handsets for the 3rd Generation (3G/3.5G) and Beyond
27 July 2006
New Joint Venture to Develop Communications Platform for Mobile Handsets for the 3rd Generation (3G/3.5G) and Beyond
13 June 2006
Fujitsu, NEC Electronics, Renesas, and Toshiba to Aim for Standardization of Semiconductor Process Technology for Next-Generation LSI
15 May 2006
NEC Electronics and Wipro Sign Certified Design House Agreement
15 May 2006
NEC Electronics and Tata Consultancy Services Sign Certified Design House Agreement
15 Feb 2006
Toshiba, NEC Electronics and Fujitsu Announce Agreement on "COSMORAM Rev. 4" Common Pseudo SRAM Specifications for Mobile Devices
1 Feb 2006
NEC Electronics, Sony, and Toshiba Announce Joint Development of 45-nanometer System LSI Process Technologies
18 Jan 2006
NEC Electronics and Siemens Announce Partnership in Real-time Ethernet Products
9 Nov 2005
Toshiba and NEC Electronics to Collaborate on 45-nanometer System LSI Process Technologies
8 Nov 2005
NEC Electronics and Link A Media Devices Enter Strategic Partnership to Develop Electronics Solutions for Hard Disk Drives
3 Oct 2005
NEC Electronics Joins the Symbian Platinum Program
13 June 2005
NEC Electronics Provides ISSP Structured ASIC Customers with Synplicity Amplify Pro as Part of NEC Electronics' OpenCAD Tool Suite
20 Apr 2005
FlipChip International and NEC Electronics sign cross-license agreement for advanced wafer level packaging technology
22 Nov 2004
NEC and NEC Electronics Join Forces to Develop System LSIs for 3G Mobile Terminals
1 Nov 2004
MontaVista and NEC Electronics Establish Strategic Linux Partnership
6 Sep 2004
Toshiba, NEC Electronics, and Fujitsu Agree on "COSMORAM Rev.3" Common Specifications for PSRAM
24 May 2004
Synplicity and NEC Electronics Ink Physical Synthesis OEM Agreement for ISSP Structured ASICs
25 Mar 2004
Transmeta and NEC Electronics Reach Agreement on Strategic Alliance for Low Power and Leakage Management
26 Feb 2004
NEC Electronics Acquires License of FlexRay IP from Bosch
3 Feb 2004
ASE to Acquire IC Packaging and Testing Operation from NEC Electronics
15 Dec 2003
NEC Electronics Announces SerDes ASIC Macro for OBSAI RP3
10 Dec 2003
NEC Electronics and Mysticom Ink Ethernet Core License Agreement
10 Dec 2003
NEC Electronics and Cadence Announce Encounter Platform to Support NEC Electronics' ISSP
20 Oct 2003
NEC Electronics and ARM Announce Long-Term Strategic Collaboration
8 Apr 2003
NEC Electronics Acquires Licenses for LCD Driver Patents from Honeywell
31 Mar 2003
QDR CoDevelopment Team Reaffirms Commitment to QDR Architecture
10 Mar 2003
NEC Electronics Teams with Global Catalyst Partners in ISSP promotion
29 Jan 2003
110 Billion Yen Syndicated Loan Agreements Signed
5 Sep 2002
Fujitsu Quantum Devices and Sumitomo Electric Industries Announce Enhancements and New Supporters for 10 Gbps Transmission Laser Diode Module Multi-Source Agreement
14 Mar 2002
Fujitsu, NEC and Toshiba Agree on Common Specifications for Next-Generation Pseudo SRAM User Interface for Mobile Applications
29 Jan 2001
NEC joins QDRTM SRAM Co-Development Team to produce Quad Data Rate SRAMs
13 Sep 2000
NEC Signs New Licensing Agreements with Rambus Includes Next-Generation Direct RDRAM Technology
12 June 2000
NEC Licenses MIPS32 4KTM family Microprocessor Cores from MIPS Technologies, for Accelerated Network Controller Product Lineup
31 Jan 2000
NEC'S MEMORY DIVISION LICENSES MOSYS' 1T-SRAMTM TECHNOLOGY FOR HIGH-DENSITY APPLICATION-SPECIFIC MEMORIES
- Patented 1T-SRAM technology delivers SRAM (sub. 10nsec. random access) performance at DRAM density -
5 July 1999
NEC and Innovatron Announce Development Partnership for Contactless Smart Card Microprocessor


 
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