NEC Electronics Showcases PCI Express, Wireless USB and Server Memory Solutions at IDF Spring 2005
Theater Presentations Highlight Interface and Advanced Memory Buffer Technologies
 |
|
|
INTEL DEVELOPER FORUM, SAN FRANCISCO, March 1, 2005 -
NEC Electronics America, Inc. today announced it will showcase its PCI ExpressTM, Wireless USB and advanced memory buffer (AMB) technologies in three separate booths at the Intel Developer Forum (IDF) Spring 2005, March 1 to 3, at the Moscone West Convention Center in San Francisco (booth numbers listed below). Demonstrations will feature the company's PCI Express switch and bridge application-specific standard products (ASSPs); AMB ASSP that supports the newest standard for high-performance memory for server applications; and Wireless USB technology. NEC Electronics America will also participate in theater presentations hosted by the IDF PCI Express and Memory Communities to highlight the technical specifications of NEC Electronics' advanced interface and AMB products.
Theater Presentations
|
|
Topic: Overview of NEC Electronics' PCI Express ASICs
and ASSPs
Location: PCI Express Community Theater
Date: March 1 at 6:00 p.m. and March 2 at 7:00 p.m.
Presenter: Peter Teng, design engineering manager, broadband LSI
technology strategic business unit
|
|
Topic: Overview of NEC Electronics' AMB ASSPs
Location: Memory Community Theater
Date: March 1 at 6:00 p.m. and March 3 at 11:00 a.m.
Presenter: Sang Shim, senior program manager, broadband LSI technology
strategic business unit
|
|
|
Booth Demonstrations
|
|
(1)
Description: System-level PCI Express demonstration highlighting a PCI
Express data transfer with an NEC Electronics switch ASSP as well as a PCI
Express to PCI-X bridge demonstration
Location: NEC Electronics America booth #814 in the PCI Express Community
|
|
(2)
Description: Wireless USB demonstration featuring a device wire adapter
demonstrating all functions running on a single board
Location: NEC Electronics America booth #321 in the Wireless USB
Community
|
|
(3)
Description: Live fully buffered dual-inline memory module (FB-DIMM)
demonstration using NEC Electronics' AMB device on a channel test card (CTC)
to demonstrate the full functionality of FB-DIMMs; Standard SRAM product
display
Location: NEC Electronics America booth #928 in the Memory Community
|
|
(4)
Description: Standard SRAM product display
Location: NEC Electronics America booth #928 in the Memory Community
|
|
PCI Express Technology
NEC Electronics' PCI Express ASSP offering includes switch and bridge chips that are compliant with revision 1.0a of the PCI Express base specification. The NEC Electronics PCI Express switch ASSP provides fan-outs for designers to employ more PCI Express ports. The PCI Express to PCI-XTM bridge ASSP allows customers to use the PCI Express and PCI-X or PCITM standards in new product designs.
Wireless USB
NEC Electronics is a leading supplier of USB solutions for worldwide customers and was the industry's first company to introduce a USB 2.0 host controller, hub controller and device controller. With a USB 2.0 product line-up that includes ASSPs and ASICs, the company has shipped more than 80 million USB 2.0 products. NEC Electronics continues to drive the development of next-generation interface technology and is now working with the Wireless USB Promoter Group to standardize specifications for wireless USB. The company is also working with partners to develop a prototype high-speed wireless USB product with ultra-wideband as the physical layer (PHY).
Advanced Memory Buffer
Fully compliant with the AMB standard ratified by JEDEC, NEC Electronics' AMB device is a key enabling technology behind the increased bandwidths and large memory capacities characteristic of emerging FB-DIMM products. Its unique channel structure mitigates buffer latency issues typical of registered DIMM memory, enabling higher levels of memory performance for applications such as servers, routers and graphics controllers. NEC Electronics is working closely with the industry's leading DRAM manufacturers to further develop the FB-DIMM market and to help drive FB-DIMMs as the next-generation memory platform for server applications.
<< Related Content >>
- - Event Information (NEC Electronics America)
- - Product Information :USB
- - Tech Highlights
About NEC Electronics America, Inc.
NEC Electronics America, Inc., headquartered in Santa Clara, California, is a wholly owned subsidiary of NEC Electronics Corporation (TSE: 6723), a leading provider of semiconductor products encompassing advanced technology solutions for the broadband and communications markets; system solutions for the mobile, PC, automotive and digital consumer markets; and platform solutions for a wide range of customer applications. NEC Electronics America offers a local manufacturing facility in Roseville, California, and the global manufacturing capabilities of its parent company. NEC Electronics America is also the North American marketing and sales channel, specializing in industrial applications, for active-matrix LCDs from NEC Technologies, Ltd., a global leader in innovative display technologies. More information about the products offered by NEC Electronics America can be found at www.am.necel.com.
***
NEC Electronics America is either a trademark or registered trademark of NEC Electronics Corporation in the United States and/or other countries. PCI-SIG, PCI Express, PCI-X and PCI are trademarks or registered trademarks of the PCI-SIG. Other product or brand names are trademarks or registered trademarks of their respective holders.
Information in the press releases, including product prices and
specifications is current on the date of the press announcement,
but is subject to change without prior notice.
| |
SITE MAP
