SANTA CLARA, Calif., February 14, 2005 -
NEC Electronics today announced the International Engineering Consortium (IEC) has presented the company with the IEC's first annual DesignVision Award in the "Semiconductors and ICs" category for its ISSP90 devices - part of the company's Instant Silicon Solution PlatformTM (ISSPTM) structured ASIC family. Following the IEC tradition, the DesignVision awards recognize companies that provide leading-edge technologies, products and services that are judged to be both unique and beneficial to the electronic design industry, as well as to society as a whole. The winners in all DesignVision Award categories were announced during a private ceremony at the Santa Clara Convention Center during DesignCon 2005.
"We are honored that the IEC, a leading provider of high-level, innovative educational opportunities, has recognized NEC Electronics' ISSP90 family of 90-nanometer structured ASICs with this DesignVision award," said Phillip LoPresti, associate vice president and general manager, custom LSI strategic business unit, NEC Electronics America, Inc. "As a leading structured ASIC supplier, NEC Electronics remains committed to providing its customers with leading-edge, cost-effective solutions that enable quicker time to market and ease-of-use as they develop their next-generation ASIC products."
About NEC Electronics' ISSP Structured ASICs
NEC Electronics' ISSP architecture was designed to serve the growing number of applications that require higher complexity and performance than an FPGA but cannot bear the high development costs associated with cell-based ASICs. ISSP structured ASICs also offer a compelling time-to-market advantage over cell-based ASICs, with development typically taking as little as four to six months as opposed to the 12 to 18 months required for most cell-based ASICs. Each NEC Electronics ISSP design begins with a prefabricated master composed of an array of complex multi-gates, embedded IP cores, built-in test circuits, clock domains and power lines. Two custom metal layers are easily and quickly placed, routed and fabricated to satisfy the unique requirements of each individual design. ISSP-based products consume much less power than a comparable FPGA and also have lower NRE costs than cell-based ASIC devices. Currently available families of ISSP structured ASICs include the 150-nm ISSP1-STD and ISSP1-High-Speed Interface (HSI) devices and the 90-nm ISSP90 devices. For further information, visit www.am.necel.com/issp.
About NEC Electronics
NEC Electronics Corporation (TSE: 6723) specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets, system solutions for the mobile handset, PC peripherals, automotive and digital consumer markets, and platform solutions for a wide range of customer applications. NEC Electronics Corporation has 26 subsidiaries worldwide including NEC Electronics America, Inc. (www.am.necel.com) and NEC Electronics (Europe) GmbH (www.ee.nec.de). In addition to marketing, selling and supporting NEC Electronics products to customers in their respective regions, NEC Electronics America and NEC Electronics Europe also operate local manufacturing facilities in Roseville, California, and Ballivor, Ireland, respectively. Additionally, NEC Electronics America for North America and NEC Electronics Europe for Europe are the sales and marketing channels of NEC AM-LCD modules. For additional information about NEC Electronics worldwide, visit www.necel.com.
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NEC Electronics, NEC Electronics America, Instant Silicon Solution Platform and ISSP are either registered trademarks or trademarks of NEC Electronics Corporation in the United States and/or other countries. All other registered trademarks or trademarks are property of their respective owners.
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