NEC Electronics Showcases Custom IC Design Expertise at DesignCon 2005
Presentations Examine the Impact of Structured ASICs on 90-nm Design Challenges and Address the Issue of Outsourcing for Custom IC Projects
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KAWASAKI, Japan, January 27, 2005 -
NEC Electronics Corporation today announced that it will highlight its strength in custom IC technologies for ASICs and structured ASICs, and deliver two presentations at DesignCon 2005 being held January 31 through February 3 at the Santa Clara Convention Center. The company also will feature product presentations and demonstrations, including demonstrations of its Instant Silicon Solution PlatformTM (ISSPTM) structured ASICs, in its booth #317 on the exhibit floor.
As part of DesignCon's technical programs, NEC Electronics and Synplicity, Inc. jointly will present a tutorial that addresses the challenges currently facing designers developing custom ICs in the 90-nm node and also examines how ASIC and EDA vendors can overcome many of these obstacles through collaboration. The second joint presentation, delivered by NEC Electronics and design service vendor GDA Technologies, will discuss the growing trend for outsourcing custom IC design and the benefits of doing so, including cost and time savings and increased access to a variety of design talent and resources. The presentation will also explore criteria to consider when choosing a design services company.
In booth #317, NEC Electronics will showcase its ISSP structured ASICs in 30-minute product presentations that provide information about the benefits of this leading-edge, structured-ASIC technology. Other products featured in demonstrations and displays at the booth will include embedded DRAM for ASICs and fast SRAM, including QDR and DDR SRAM.
Presentation Overviews
| Topic: |
Customized Synthesis for Structured ASICs - Delivering Higher Performance,
Quicker Time to Market and Reduced Work on the Back End |
| Date: |
January 31 at 1:30 p.m. |
| Presenters: |
Stuart Hamilton, director, Design Solutions Center, NEC Electronics America
and John Gallagher, senior director of ASIC synthesis marketing, Synplicity |
| Topic: |
Outsourcing Designs for Nimble Product Development |
| Date: |
February 1 at 10:10 a.m. |
| Presenters: |
Steven Kawamoto, senior marketing manager, NEC Electronics America and
Ravi Thummarukudy, vice president and general manager, IC Design Solutions,
GDA Technologies |
| Topic: |
NEC Electronics' ISSP Structured ASICs |
| Location: |
NEC Electronics America booth #317 |
| Date: |
February 1 and 2 at 1:00, 2:00, 3:00, 4:00, 5:00 and 6:00 p.m. |
| Registration: |
Seating for these sessions is limited. To participate, register online
at www.am.necel.com/DC05reg. |
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About ISSP Structured ASICs
The ISSP architecture was designed to serve the growing number of applications that require higher complexity and performance than an FPGA but cannot bear the high development costs associated with cell-based ASICs. ISSP structured ASICs also offer a compelling time-to-market advantage over cell-based ASICs, with development typically taking as little as four to six months as opposed to the 12 to 18 months required for most cell-based ASICs. Each NEC Electronics ISSP design begins with a prefabricated master composed of an array of complex multi-gates, embedded IP cores, built-in test circuits, clock domains and power lines. Two custom metal layers are easily and quickly placed, routed and fabricated to satisfy the unique requirements of each individual design. ISSP-based products consume much less power than a comparable FPGA and also have lower NRE costs than cell-based ASIC devices. Currently available families of ISSP structured ASICs include the 150-nm ISSP1-STD and ISSP1-High-Speed Interface (HSI) devices and 90-nm ISSP90 devices. For further information, visit www.am.necel.com/issp.
About NEC Electronics America, Inc.
NEC Electronics America, Inc., headquartered in Santa Clara, California, is a wholly owned subsidiary of NEC Electronics Corporation (TSE: 6723), a leading provider of semiconductor products encompassing advanced technology solutions for the broadband and communications markets; system solutions for the mobile, PC, automotive and digital consumer markets; and platform solutions for a wide range of customer applications. NEC Electronics America offers a local manufacturing facility in Roseville, California, and the global manufacturing capabilities of its parent company. NEC Electronics America is also the North American marketing and sales channel, specializing in industrial applications, for active-matrix LCDs from NEC Technologies, Ltd., a global leader in innovative display technologies. More information about the products offered by NEC Electronics America can be found at www.am.necel.com.
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NEC Electronics, Instant Silicon Solution Platform and ISSP are either registered trademarks or trademarks of NEC Electronics Corporation in the United States and/or other countries. All other registered trademarks or trademarks are property of their respective owners. #11220
Information in the press releases, including product prices and
specifications is current on the date of the press announcement,
but is subject to change without prior notice.
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