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NEC Electronics Starts Shipping Single-Chip LCD Controller Driver with On-Chip Graphics Engine
One of the Industry's First TFT-LCD Drivers to Implement Graphics Engine Enabling High-Quality Display
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| "TFT-LCD controller driver integrating graphics engine on-chip" |
KAWASAKI, Japan, and Dusseldorf, Germany, October 2, 2003 -
NEC Electronics Corporation and its subsidiary in Europe, NEC Electronics (Europe) GmbH, today announced they started sample shipment of one of the industry's first TFT-LCD controller driver integrating graphics engine on-chip. The new device is targeted for mobile handsets which require high-quality display and compact body sizes.
The new chip is a complete single-chip controller driver for TFT-LCD displays for mobile applications, implementing all the necessary components for image processing such as the source driver, gate driver, power supply, and display SRAM, as well as the graphics engine. The graphics engine incorporated was developed for NEC Electronics by Bitboys Oy, a graphics hardware company headquartered in Noormarkku, Finland, and is the industry's first graphics engine capable of curve rendering.
The implementation of this graphics engine eliminates the need of an external device or modification to the baseband LSI in actualizing high-speed drawing of smooth and high-quality graphics. Based on hardware, it is capable of high-speed processing of vector graphics such as scalable vector graphics. By combining with the antialiasing function, it enables a smooth and high-speed drawing which was not achievable with the software processing. Moreover, the graphics engine integrates the 16-steps alpha blend function and is capable of displaying graphical images with rich expressions. The graphic engine portion can be switched off when the functions are not required, which contributes to power efficiency.
As an added benefit, the single-chip LCD controller driver enables users to simplify the board design and lower the cost of the system board. The device can be mounted to the contact edge of the LCD glass directly via chip-on-glass interconnection (COG), which also contributes to compact and easy board designing.
Inheriting the CPU and interfaces applied in the previous products, the device can be connected to the existing baseband LSI without modification. It also has compatibility with existing LCD controller driver ICs without graphics engine and allows users to utilize the functions available in the existing mobile phones such as display of still pictures.
NEC Electronics will exhibit and demonstrate the product at CEATEC JAPAN 2003, a major show covering communications, information and video, that will be held at Makuhari Messe, Tokyo, Japan, starting October 7.
Availability
Engineering samples are available at US$19 each. Mass production is slated to start in December 2003 with the volume expected to reach 500,000 pieces per month in March 2004.
For product outline, please see the attached sheet.
About NEC Electronics
NEC Electronics Corporation (TSE: 6723) specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets, system solutions for the mobile handsets, PC peripherals, automotive and digital consumer markets,
and platform solutions for a wide range of customer applications. NEC Electronics Corporation has 24 subsidiaries worldwide including NEC Electronics America, Inc. (www.am.necel.com) and NEC Electronics (Europe) GmbH (www.ee.nec.de). In addition to marketing, selling and supporting NEC Electronics products to customers in their respective regions, NEC Electronics America and NEC Electronics Europe also operate local manufacturing facilities in Roseville, California, and Ballivor, Ireland, respectively. Additionally, NEC Electronics America for North America
and NEC Electronics Europe for Europe are the sales and marketing channels of NEC AM-LCD and PDP modules. For additional information about NEC Electronics worldwide, visit www.necel.com.
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Information in the press releases, including product prices and
specifications is current on the date of the press announcement,
but is subject to change without prior notice.
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