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NEC Electronics Unveils Industry's Smallest and Thinnest Leadless Packages for Small Signal Discrete Devices
Enabling Compact Board Layout for Various Mobile Applications
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| "1008 and 1006" |
KAWASAKI, Japan, August 4, 2003 -
NEC Electronics Corporation today announced that it has started sampling of the smallest and thinnest leadless packages in the industry for small signal discrete devices. These new leadless packages, designated as package type 1008 and package type 1006, have achieved the world's smallest size, greatly contributing to the reduction of printed circuit board size for portable devices such as personal digital assistants (PDAs) and mobile handsets.
The first products that will be housed in these new packages are built-in resistor transistors consisting of two chips, which will be placed in package type 1008 (1.0 x 0.8 x 0.36 mm typ.), and junction field effect transistor (JFET) series for electret condenser microphones (ECM), which will be placed in package type 1006 (1.0 x 0.6 x 0.36 mm, typ.).
As some passive components like capacitors and resistors are beginning to come in small and thin packages, such as type 0603 with 0.3 mm thickness, type 1006 with 0.5 mm thickness, and 1008 with 0.5 mm thickness, small-signal discrete devices often become bottlenecks for size reduction of compact, mobile applications, especially mobile handsets. Leveraging the company's leading-edge technologies in wire connection, leadframe production, resin enclosure and chip polishing, NEC Electronics has brought about the same level of compactness for the packages of transistors, enabling the installation of various components in size-sensitive applications such as cellular phones and PDAs.
By using package type 1008 for a two-chip transistor with built-in resistor (40V/50mA), the mounting area can be reduced by twenty percent compared to traditional packages, and the mounting height can be reduced to 0.4 mm. By using package type 1006 for JFET (20V/10mA), the mounting area can be reduced by 25% compared to conventional packages, making installation into a 1 mm-thick ECM possible.
"NEC Electronics aims to provide a variety of products for mobile applications," said Yoshihiko Miura, general manager, 2nd Solutions Division, NEC Electronics Corporation. "These new compact packages with small-signal discrete devices are a significant addition to our broad product lineup for applications like cellular phones and PDAs."
Pricing and Availability
The product is now available for sample shipment and mass production is slated to begin by the end of 2003. The sampling prices are $0.05 for type 1008 and $0.09 for type 1006, both in US dollars. Pricing is subject to change.
For Supplementary Information, please see the attached sheet.
About NEC Electronics Corporation
NEC Electronics Corporation (TSE: 6723) specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets, system solutions for the mobile handsets, PC peripherals, automotive and digital consumer markets, and platform solutions for a wide range of customer applications. NEC Electronics Corporation has 24 subsidiaries worldwide including NEC Electronics America, Inc. (www.am.necel.com) and NEC Electronics (Europe) GmbH (www.ee.nec.de). For additional information about NEC Electronics worldwide, visit www.necel.com.
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Information in the press releases, including product prices and
specifications is current on the date of the press announcement,
but is subject to change without prior notice.
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