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NEC Compound Semiconductor Devices Delivers Compact Receptacle Laser Diode Modules for Metro Access Applications
-The Industry's Smallest Receptacle Laser Diode with Reliable Data Transmission-
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| "Laser Diode Modules for Metro Access Applications" |
KAWASAKI, Japan, Mar. 11, 2003 -
NEC Compound Semiconductor Devices Ltd., today announced the production start of compact receptacle laser diode (LD) modules for industry standard small-size transceivers.
New devices, designed with 3.8mm outer diameter header and the short focal length optics, realize 12mm overall length which makes them the smallest receptacle modules available in the market. Additionally, the new LD modules, named NX831*U* series, have LC connector sleeve structure that allows simple optical coupling, making them the perfect fit for small-size transceivers such as SFF (Small Form Factor) and SFP (Small Form Factor Pluggable). These compact LD modules and transceivers offer the benefits of high efficiency and space saving, providing customers the flexibility to build optical networking systems that match diversified environment and applications.
To realize the smallest receptacle LD module in the industry, NEC Compound Semiconductor Devices has mounted 1310nm DFB (Distributed Feedback)-LD and monitor photo diode in 3.8mm outer diameter header with high precision technique. Following the process, the device has been hermetically sealed in nitrogen atmosphere to secure the same or better reliability than the conventional devices. Combined with newly designed aspherical lens for short focal length, the LD module has been made 30% smaller than the previous offerings from the company. Moreover, the SFF and SFP transceiver assembly process has been made simple due to the 1.25mm inner diameter LC sleeve structure. The new device has wide operation temperature range of -20 to 85 deg C (-40 to 85 degC for 622Mbps) and does not require temperature regulation using Peltier element.
"There is a strong demand for small-size, reliable LD modules which fit compact transceivers for optical networking such as SFF and SFP," said Masayuki Yamaguchi, Department Manager, 1st Optical Semiconductor Department, NEC Compound Semiconductor Devices. "In order to meet the requirements for higher speed and bandwidth especially from MAN (Metro Area Network) market, it is crucial to provide this kind of miniature LD module to help our customers assembly as many modules as possible in limited space."
This new device covers all applications from 622Mbps to 2.5Gbps up to 40km (OC-12; LR, OC-48; IR/LR), per SDH (ITU-T G.957) and SONET standards. For 2.5Gbps up to 15km (OC-48; IR) application, both isolated and non-isolated versions are available.
Pricing and Availability
Samples are available at $130 in the United States. Mass production volume is expected to reach 20 thousand parts per month. Together with previously announced FP LD (Fabry-Perot LD) receptacle devices, NX7312*UA series, the new devices provide the full line up of miniature receptacle packages for wide variety of 155Mbps-2.5Gbps applications.
For key specs of NX831*U*, please see the attached sheet.
About NEC Compound Semiconductor Devices, Ltd.
NEC Compound Semiconductor Devices, Ltd. (NEC Compound Semiconductor Devices) is a leading provider of optical and microwave devices, committed to meeting the specialized needs of its customers in the broadband and mobile networking fields with its compound and silicon semiconductor technologies. NEC Compound Semiconductor Devices was divided from NEC Corporation and established in October 2001, and now a subsidiary of NEC Electronics Corporation. For further information, please visit the home page at: http://www.csd-nec.com/
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Information in the press releases, including product prices and
specifications is current on the date of the press announcement,
but is subject to change without prior notice.
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