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PRESS RELEASES

PRESS RELEASES (2006)

PRESS RELEASES (2006)
15 Feb	Toshiba, NEC Electronics and Fujitsu Announce Agreement on "COSMORAM Rev. 4" Common Pseudo SRAM Specifications for Mobile Devices

PRESS RELEASES (2004)

PRESS RELEASES (2004)
8 Nov	NEC Electronics Introduces Industry's First Pseudo Static Random Access Memory (PSRAM) Device Standardized for COSMORAM Rev.3
6 Sep	Toshiba, NEC Electronics, and Fujitsu Agree on "COSMORAM Rev.3" Common Specifications for PSRAM

PRESS RELEASES (2003)

PRESS RELEASES (2003)
17 Feb	Fujitsu, NEC and Toshiba Agree on Common Specifications for "Burst Mode" Pseudo SRAM User Interface
6 Jan	NEC Electronics Develops 1.8-Volt NOR-Type Flash Memory With Industry’s Highest Capacity of 256 Megabits -Memory Technology Uses Multi-Level Cells to Reduce Design Costs-

PRESS RELEASES (2002)

PRESS RELEASES (2002)
18 Sep	NEC to Begin Sampling High-Density Late-Write SRAM with Fast Access Speeds
15 Apr	NEC Ships QDR™II/DDR II Family of High-Speed SRAM Products
14 Mar	Fujitsu, NEC and Toshiba Agree on Common Specifications for Next-Generation Pseudo SRAM User Interface
22 Jan	NEC Develops World's Fastest 64M-bit Low Power Memory Specified for Mobile Applications

PRESS RELEASES (2001)

PRESS RELEASES (2001)
3 Sep	NEC Develops 64Mb Dual-Operation Flash Memory for Ultra-Low-Power Mobile Applications -Achieving Top Class Ultra-Low-Power Operation Voltage-
29 Aug	NEC Develops Low-power, Stacked Multi-Chip Package High-density RAM -Set to advance the new wave of multi-functional cellar and PHS phones-
29 Jan	NEC joins QDR SRAM Co-Development Team to produce Quad Data Rate SRAMs

PRESS RELEASES (2000)

PRESS RELEASES (2000)
13 Sep	NEC Signs New Licensing Agreements with Rambus Includes Next-Generation Direct RDRAM Technology
24 Aug	NEC Develops World's First Low Power Memory Specified for Mobile Applications
31 Jan	NEC'S MEMORY DIVISION LICENSES MOSYS' 1T-SRAM™TECHNOLOGY FOR HIGH-DENSITY APPLICATION-SPECIFIC MEMORIES - Patented 1T-SRAM technology delivers SRAM (sub. 10nsec. random access) performance at DRAM density -
17 Jan	MULTIPLE COMPANIES AGREE TO DEVELOP ADVANCED DRAM TECHNOLOGY

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