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Medity2 is a semiconductor chipset centered on the M2 LSI, which integrates DBB and an application processor. It features also a wireless frequency processing (RF) IC and a power IC.
3.6 Mbps HSDPA is achieved by the built-in functions of the M2, and support of 7.2 Mbps HSDPA is realized through the use of an external accelerator LSI.
In addition to featuring newly developed low-power-consumption technology, the M2 enables the creation of more compact and cheaper handsets through the reduction of the number of components, something that is achieved through total sharing of external memory among the DBB and application processing functions and other means.
The M2 is a low-power-consumption system LSI that features various application functions on a single chip and supports the W-CDMA third-generation (3G to 3.5G) communication standard and 7.2 Mbps HSDPA.
While the M1 was based on the ARM926EJ-S core, the M2 chip utilizes the more advanced ARM1176JZF-S core, delivering a significant improvement in performance.
Through a combination of several advanced technologies, power consumption was reduced by 50 percent. This improvement was made possible by a host of advancements in circuit design and layout, including dynamic frequency scaling, automatic hierarchical clock control, LCD Direct Path technology, on-chip power switch technology, Quick Recovery technology. In addition, the use of 65-nanometer process technologies such as Multi-Vt transistor technology, and back-bias technique also contributed to lower power consumption.
The M2 also conforms to NEC Electronics platformOViA for higher software development efficiency.
The specifications of the M2 are listed below. For details, please contact your local sales representative.
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Medity is a registered trademark or trademark in Japan and Germany and other countries of NEC Electronics Corporation.