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Medity1 Chipset
Medity1 Chipset
The main components of Medity1 chipset are M1(DBB/Application integrated chip), RF IC, and power ICs.
BOM reduction including memory sharing between the 3G communications core and the application processor achieves lower cost and smaller footprint.
DBB/application integrated chip M1(S) plays a key element in the total solution
M1(S) is the system LSI for Medity1 that integrates 3G digital baseband core and an application processor on a single chip with SDRAM.
The application processor features a high-performance CPU(ARM926EJ-S) and DSP functions for sophisticated media processing.
New clock control technology and power supply voltage adjustment on every domain optimally achieve low power operation in any conditions.
M1 specifications
M1's main functions are listed below. For details, please contact your local sales representative.
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- 529-pin FPBGA package (14mm×14mm)
Medity is a registered trademark or trademark in Japan and Germany and other countries of NEC Electronics Corporation.
