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Volume 20 (Apr 19, 2004)
3G BTS Systems and NEC Electronics (2/2)
NEC Electronics and its support of 3G mobile phone systems
NEC Electronics has created a line of semiconductor devices for use in wireless base station construction, and is thereby contributing to the realization of 3G mobile phone systems. Our backplane transceiver LSI chips, the µPD98441 (Figure 2), is example of such devices and is optimized for backplane transmission between chips mounted on different circuit boards in BTS systems.
The Universal Test and Operation PHY Interface for ATM (UTOPIA) and Packet Over SONET PHY (POS-PHY) are employed for data transmission by most chips that perform conversion or switching in the control circuit boards used in wireless base stations and communication circuit boards for linking to the overlying RNC (radio network control). As UTOPIA and POS-PHY are parallel interfaces that transmit data on 16 or 32 signal lines, engineers are face with problems such as complex wiring and the necessity of a large surface area for wiring. Our backplane transceiver LSI devices convert from a parallel interface to a serial interface, and transmit serial data at speeds up to 880 Mbps on the Low-Voltage Differential Signaling (LVDS) level. Serial data backplane transmission improves the mounting footprint efficiency, achieves low power consumption and contributes to reduced system cost.
The µPD98441 that has two channels of LVDS links, you can use half of the channels for redundant links, and construct highly reliable systems.
The µPD98441 is ideal for both ATM base network and IP base network systems such as Digital Subscribe Line Access Multiplexer (DSLAM) systems that bundle together multiple xDSLs and act as high-speed bridges to large-capacity backbone networks through routers and other telecommunications systems.
Challenges to high-speed interface IP core (macro) development
The popularity of 3G mobile phone systems has boosted the demand for constructing high-performance base stations with a short turnaround time and low cost. NEC Electronics is working to meet the needs of the wireless infrastructure industry and is meeting the challenge of high-speed interface macro development. Our µPD98441 backplane transceiver is example of such devices that were developed using the high-speed interface macro.
NEC Electronics is also developing a high-speed interface macro that meets the specifications of Reference Point 3 (RP3) of the Open Base Station Architecture Initiative (OBSAI) intended to standardize the interface between different base station modules. The new high-speed macro has been designed for our CB-130 ASIC technology. System chips incorporating the high-speed interface macro meeting the RP3 specifications can reduce the costs of BTS system development and system introduction.(Figure 3)
The RP3 specification defines data rates of 768 Mbps and 1.536 Gbps between the baseband (signal) processing and radio components of a wireless base station. Our new high-speed interface macro is the first in the industry to handle both data rates. The macro also conforms to the 10 Gbps Attachment Unit Interface (XAUI) of Ethernet and InfiniBand® standards. Furthermore, the macro handles up to 16 channels. With these features, our new macro supports optimized system construction to satisfy the demands of customers.
With the development of the high-speed interface macro and LSI chips that incorporate them, NEC Electronics offers optimized solutions that lead the industry. Our leading-edge semiconductor technologies will support the evolution of 3G mobile phone systems.
* OBSAI is a group of nearly 70 leading manufacturers of wireless infrastructure equipment, related modules and components from all over the world.
* InfiniBand is a registered trademark of the InfiniBand Trade Association.
Volume 21
