By Category

The "2009 Symposia on VLSI Technology and Circuits"—widely recognized as premiere conferences for presenting research results on the latest device, process, and circuit-related developments—were held this year at the Rihga Royal Hotel in Kyoto, Japan, from June 15 to 18. Here we introduce the papers presented by NEC Electronics or in collaboration with NEC Corporation.

• 2009/09/25　"A new measurement method and analytical modeling: Single-charge-based Modeling of Transistor Characteristics Fluctuations Based on Statistical Measurement of RTN Amplitude" has been added.

The twelfth annual IEEE-sponsored International Interconnect Technology Conference—IITC 2009—was held in Sapporo, Japan from June 1 to June 3. Regarded as a premier conference for announcing cutting-edge interconnect-related technologies, here we introduce the papers presented by NEC Electronics or in collaboration with NEC Corporation.

• 2009/10/28　"Wiring Technology for Reducing Power Consumption and Improving Reliability in System LSI chips" has been added.

The IEEE International Solid State Circuits Conference (ISSCC)—introducing cutting-edge integrated-circuit technologies—was held February 8-12 in San Francisco, California, USA and featured several papers introducing the findings of collaborative research conducted recently by NEC Corporation and NEC Electronics.

The world's most advanced interconnect technology was announced at the IEEE International Interconnect Technology Conference (IITC) 2008, held June 1 to June 4 in San Francisco. Engineers from NEC Corporation and NEC Electronics introduced their joint research results at this year's conference.

The "2008 Symposia on VLSI Technology and Circuits"—widely recognized as premiere conferences for presenting research results on the latest device, process, and circuit-related developments—were held this year at the Hilton Hawaiian Village Hotel in Hawaii, from June 17 to 20. Here we introduce the papers presented by NEC Electronics or in collaboration with NEC Corporation.

The ESD Association's annual "2007 EOS/ESD Symposium," a premier international event focused on electrical overstress and electrostatic discharge failures and solutions in electronic devices and parts, was held in Anaheim, California, USA, from September 16—21. Here we will briefly introduce the research findings presented by NEC Electronics engineers at this year's EOS/ESD Symposium.

NEC Electronics has developed a 55-nanometer (nm) cell-based integrated circuit (IC) capable of dramatically reducing power consumption. Utilized in this IC is a low standby power CMOS technology that supports extended battery usage in mobile phones and other portable devices. We asked the developers of the first practical application of high-k gate insulation film to discuss their journey to make ultra-thin high-k a reality.

The "2007 Symposia on VLSI Technology and Circuits"—widely recognized as premiere conferences for presenting research results on the latest device, process, and circuit-related developments—were held this year at the Rihga Royal Hotel in Kyoto, Japan, from June 11 to 16, 2007. Here we will introduce the papers presented by NEC Electronics in collaboration with NEC Corporation.

2007/09/25 "Development of Fundamental New Technologies Enabling Further Digitization of Wireless IP Cores" has been added.

The world's most advanced wiring technology was announced at the IEEE International Interconnect Technology Conference (IITC) 2007, which was held from June 4 to June 6, 2007 in San Francisco, California. Engineers from NEC Electronics and NEC Corporation introduced their joint research results at this year's conference.

To achieve high-resolution display of graphics in cellular phones and other high-end consumer devices, high-speed data processing is certainly required, but larger memory capacity and high-speed data transfers between the processor and memory are also indispensable. In this article, we will introduce SMAFTI, a promising new system-in-package (SiP) architecture that was specifically developed to meet these high-speed data transfer and large memory capacity requirements at low cost.

A powerful statistical modeling-based algorithm has been developed for determining optimal timing design margins to address the challenge of increasing interconnect parameter variations in the development of system LSI chips for the 65-nanometer (nm) node and beyond. The algorithm has now been incorporated in an RC extraction tool and been proven to result in enhanced design capabilities.

The robustness of transistors to electrostatic discharge (ESD) drops remarkably with the scaling down of feature dimensions in semiconductor devices. We have developed a new type of ESD-protection device for power supply systems and a protection circuit to improve ESD robustness. These new techniques target system-on-a-chip (SoC) devices with multiple power domains that separate power supplies to improve noise characteristics and decrease power consumption.

The "2006 Symposia on VLSI Technology and Circuits"—recognized as the premiere conference for presenting research results on the latest device, process, and circuit-related developments—were held at the Hilton Hawaiian Village Hotel in Honolulu June 13 to 17 and featured a number of papers presented by NEC Electronics in collaboration with NEC.

The ninth annual IEEE International Interconnect Technology Conference (IITC), a premier conference for presenting and discussing the latest interconnect and packaging technologies, was held in San Francisco June 5 to 7, 2006. A number of collaborative NEC Electronics/NEC papers were selected for inclusion at this year's conference.

ISSCC 2006 (IEEE International Solid State Circuits Conference)—featuring papers on cutting-edge integrated-circuit technologies—was held February 5-9 in San Francisco, California, and featured several papers introducing the findings of collaborative research conducted recently by NEC Corporation and NEC Electronics.

From June 14 to 18, the 2005 Symposia on VLSI Technology and Circuits was held at the Rihga Royal Hotel in Kyoto, where a number of scientists made presentations about the state -of -the art in device, process and circuit technology. This article summarizes the research results presented by NEC Electronics in collaboration with NEC at the symposia this year.

NEC Electronics' concurrent design flow makes it possible for engineers to verify chip and package designs very precisely in the early stages of the design process. This article explains how the revolutionary flow helps shorten development periods and accelerate time to market.

NEC Electronics beat its competitors to market with the industry's first EMI measurement method for semiconductors, a technology that can enable customers to reduce the EMI noise generated by electronic devices. The path to delivering this technology, however, was by no means a smooth one.

What to do with the many millions of transistors that fit into today's chips? If you design those chips, you probably want to use huge numbers of transistors to make memory, because every system-on-a-chip (SoC) needs lots of it. Using external DRAM-like the memory chips in PCs-slows an SoC down and uses more power. Putting the memory inside the SoC also shrinks everything by reducing the overall number of components and the number of pins on the SoC.

The IEEE International Solid-State Circuits Conference (ISSCC) each year presents the latest advances in integrated circuit technology. This year's ISSCC was held in San Francisco February 6 through 10 and featured some results from the research conducted jointly by NEC Electronics and NEC Corporation.

The 2003 VLSI (Very Large-Scale Integration) Symposia, an influential international semiconductor conference, was held on June 10-14, 2003, in Kyoto, Japan. Here we will introduce the research results presented by NEC Electronics at the VLSI Symposia.

On May 5 (U.S. time), NEC Electronics America successfully demonstrated the PCI Express™ system, the next-generation bus standard advocated by Intel Corporation, at the Windows® Hardware Engineering Conference (WinHEC) in New Orleans.