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Products > ASIC > Gata Array and Embedded Array > Packages >

Packaging Solutions


RoHS

NEC Electronics offers a wide variety of packaging options for gate arrays, with special emphasis on small-outline packages with low pin counts. All of our packaging solutions are available in RoHS-compliant versions.



QFN (Quad Flat Non-leaded)

QFN (Quad Flat Non-leaded)
  • Thin and high density
  • 28 to 48 pins
  • 5 × 5 mm to 7 × 7 mm body sizes


QFP (quad flat pack)

  • Well-established, general-purpose package
  • 44 to 304 pins
  • 0.4 to 1 mm pin pitch
  • 7 × 7 mm to 40 × 40 mm body sizes
  • 1 or 2.7 mm package height
QFP (quad flat pack)


FPBGA (fine-pitch ball grid array)

FPBGA (fine-pitch ball grid array)
  • Small-footprint, low-height and low-weight chip-size package
  • 48 to 393 balls
  • 0.5 to 1 mm ball pitches available
  • 4.38 × 4.38 mm to 19 × 19 mm body sizes


PBGA (plastic ball grid array)

  • Low-cost BGA package
  • 225 to 672 balls
  • 1 or 1.27 mm ball pitch
  • 17 × 17 mm to 35 × 35 mm body sizes
PBGA (plastic ball grid array)


ABGA (advanced ball grid array)

  • High performance and high power consumption
  • 352 to 756 balls
  • 1.27 mm ball pitch
  • 35 × 35 mm to 45 × 45 mm body sizes


SSOP (small single-outline package)

SSOP (small single-outline package)
  • 20 or 30-pins
  • Standardized package solution
  • 6.65 × 6.1 mm to 9.85 × 6.1 mm body sizes