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Back-End Processing (Assembly and Testing)
Dicing
In back end processing, a wafer completed in front end processing is cut into individual IC chips and encapsulated into packages. The cutting of the IC chips is called "dicing". The wafer is first ground to a thickness suitable for cutting (approximately 300μm), after which a piece of UV tape is adhered to its backside, fixing it to a table. An extremely thin circular blade covered with diamond grains (dicing saw) is used to cut the wafer apart.
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Terms
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Dicing
