The IC manufacturing process can be divided into three phases.
Click a process to
learn its details.
During the “design / mask creation” phase,
the function of the IC is defined, the electric circuit is designed, and a mask for IC manufacturing is
created based on the design.
During the front-end processing phase,
an IC is created on a silicon
substrate (referred to as a “wafer”).
During the back-end processing phase,
the IC chips created during the front-end processing
phase are encapsulated into packages, and thoroughly
inspected before becoming completed products.
This procedure is used for the formation
of a circuit pattern during various
front-end processes.
A device insulation layer (field oxide-film) is
formed for electrical isolation of the
devices.
Transistors are formed in the active regions to control the flow of electrons.
Devices, such as transistors, are interconnected to form an electronic circuit.
This site guides you through
the manufacturing process with
narrations and Flash
animations.
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