*****For immediate use July 19th, 2002
NEC Announces World's Lowest Capacity ESD Protection Device for High-Speed Interfaces
 |
| "NSAD500F,NSAD500H" |
NEC Corporation announced the development of the world's lowest capacity electrostatic discharge (ESD) protection devices (product code: NSAD500F, NSAD500H) used to guard system LSI (Large Scale Integration) chips in high-speed interfaces against ESD conditions. Achieving an inter-terminal capacity 50% lower than current NEC ESD protection devices, the new NEC surge absorber device (NSAD) series greatly reduces the impact on data transmission during high-speed signal processing. Product samples are available now.
Main Features of the new NSAD include:
-
The world's smallest inter-terminal capacity of 3.5pF(TYP). A 50% reduction in inter-terminal capacity compared with NEC's conventional devices.
-
ESD protection assurance at IEC61000-4-2 level 4 (contact electric discharge: 8 kV), the ESD protection standard for semiconductor terminals set by the International Electromechanical Commission.
-
Compact package for easy design in accordance to the width of interface connector wire - SC-59 (2.8 mm x 2.9 mm x 1.4 mm) for 2 circuits and SC-88A (2.1 mm x 2.0 mm x 0.9 mm) for 4 circuits.
Pricing and Availability
Sample pricing of the new products is set at 15 yen/unit for 2 circuits and 20 yen/unit for 4 circuits. Volume production of 40 million units per month is scheduled to begin during July.
Background
Demand for high-speed interfaces such as USB 2.0, IEEE1394 and 100B that exceed a transmission rate of 100 MHz is increasing rapidly as speed and functionality of electronic products such as personal computers, routers and peripherals improve. For slower communication speeds in the double digit MHz range, the Zener diode-type protection devices with inter-terminal capacity of around 7 pF have been sufficient to protect the transmission circuit from ESD.
However, for high-speed interface transmission circuits, because very fine integrated circuit line-widths of less than 0.2 µm are required, the chip's susceptibility to damage from ESD that enters from the exposed chip terminal tends to increase. Additionally, protection devices with large inter-terminal capacities are unable to accurately transmit data because the waveforms become distorted during the data transmission process.
To overcome these issues, NEC developed NSAD, the world's lowest inter-terminal capacity ESD protection device that substantially reduces the impact on data transmission during high-speed interfacing with USB2.0, IEEE1394 and 100B, and enhances the chip by ensuring its reliable and accurate operation.
Please see attachment for the main specifications of NSAD.
About NEC Corporation
NEC Corporation (NASDAQ: NIPNY) is a leading provider of Internet solutions, dedicated to meeting the specialized needs of its customers in the key computer network and electron device fields through its three market-focused in-house companies: NEC Solutions, NEC Networks and NEC Electron Devices. NEC Corporation, with its in-house companies, employs more than 140,000 people worldwide and saw net sales of approximately $39 billion in fiscal year 2001-2002. For further information, visit the NEC home page at http://www.nec.com/.
***
Press Contacts:
