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Press Release
*****For immediate use August 29, 2001 NEC Develops Low-power, Stacked Multi-Chip Package High-density RAM-Set to advance the new wave of multi-functional cellular and PHS phones-
TOKYO August 29, 2001 - NEC Corporation (NEC) (NASDAQ: NIPNY) (FTSE: 6701q.l) (TSE: 6701) announced today the development of a 20 megabit (Mb) to 48Mb low power, stacked multi-chip package (S-MCP) high density random access memory (RAM) series, specifically targeting mobile applications, such as cell phones, PDAs and other mobile terminals. Volume production is scheduled to start from September with the release of the 16Mb mobile specific/4Mb SRAM package (product name: MC-2311100). The new flexible S-MCP RAM lineup includes combinations of 16 and 32Mb RAM for mobile applications (product code: µPD4616112/µPD4632312) and the 8Mb and 4Mb low-power SRAM (product code: µPD448012/ µPD444012A) ideal as battery back-up memory. From the 4 chips offered by NEC, either using a combination of 2 or 3 chips gives customers a total RAM capacity of 20Mb to 48Mb. This flexibility means customers can choose to use the mobile specific RAM and SRAM for their respective tasks of working memory and backup memory, or depending on the task needed the entire memory capacity can be used for working function. Along with the flexibility, NEC has dramatically reduced the power consumption levels as well. The low power 8Mb and 4Mb SRAM uses full CMOS memory cells achieving a best, low standby dissipation of 13microamps (uA) for the 8Mb and 7uA at 3.0 V. On the RAM side, through adopting 32Mb and 16Mb mobile specific RAM a standby dissipation of 100uA and a "Power Down" mode with standby dissipation of 10uA has been accomplished. With cellular and personal handyphone systems (PHS) beginning to offer Internet connectivity together with larger, color displays and greater audio-visual capabilities, a greater array of services to utilize these features is being offered. This is creating increased demands for higher capacity RAM in phones and terminals at lower cost. To meet these needs, NEC developed the 32Mb and 16Mb mobile specified RAM; the 16Mb product currently in mass production, and the 8Mb and 4Mb low power SRAM which is used in most cellular and PHS phones as battery backup. The new series, achieved by using S-MCP technology combines both the mobile specific RAM and low-power SRAM on aboard one package achieving extremely compact, high density RAM with decreased low-power consumption, and looks set to advance the new wave of multi-functional cellular and PHS phones. The sample price for MC-2311100 is 2000 yen with a total production amount for the four combinations planned at 1 million units per month. About NEC Corporation ***
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