PC and Peripheral DevicesDIGITAL CAMERA
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 The consumer digital camera market continues to prosper in Japan as well as in Europe and the USA. In this market, popular models are becoming polarized: at one end of the market are models for which simplicity and low price are paramount, while at the other are those that emphasize high picture quality. In models offering high picture quality, the question of how to perform high-speed processing of image data in the mega-pixel range is becoming an important determinant of product quality.
A customized image processing IC is used in this processing, and renowned NEC Electronics design technology supports and enables the efficient development of customized ICs capable of processing images at ultra high speed.
Also, mounting one-chip for multiple devices by utilizing SiP (System in Package) technology is becoming important: to mount to mobile phones; to deal with the trend toward thinner and more compact digital cameras; and to deal with the practice of model changes in such a short period, NEC Electronics views this issue to be the most important for mounting technology, thus the company has structured itself to enable maximum support for this issue.
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Image processing, System control, Interface
Sub micricomputer
Power IC
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