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Introduction to General-Purpose Products for Third Generation Mobile Phones


Third Generation Mobile Phones


MOSFETs Used for Power Supply and Battery Protection Blocks


In the area of discrete products for mobile phones, key demands of which are downsizing and low power consumption, NEC Electronics offers a line-up of MOSFETs that achieve low on-resistance by employing leading-edge process (0.25 μm) and wireless bonding implementation technologies. We are also rolling out a range of packages in response to the trend toward smaller and thinner devices.

Road Map


Figure 1:Downsizing of MOSFETs Protecting Li-ion Secondary Batteries in Mobile Phones
Figure 1:Downsizing of MOSFETs Protecting Li-ion Secondary Batteries in Mobile Phones



Circuit Diagram


Figure 2:Circuits in Power Supply and Peripheral Blocks in Mobile Phone
Figure 2:Circuits in Power Supply and Peripheral Blocks in Mobile Phone


Li-ion Secondary Battery Protection Circuit in Mobile Phone
- Small-package dual N-Channel MOSFETs featuring low on-resistance
  • The 6pHWSON: a smaller and thinner package
  Footprint Height Weight
8pTSSOP 20mm2 1.2mm MAX 40mg
6pHWSON 10mm2 0.8mm MAX 19mg

Offers heat resistance equivalent to that of the previous 8pTSSOP
(Drain electrode is on the back of the substrate)

  • Low on-resistance 8pTSSOP
    μPA1872B: TYP 10 mΩ at Nch 20V
    (For VGS=4.5 V)
  • High ID (pulse) withstand capability
Comparison of Packages (Maximum Dimensions in mm)
Figure 3:Comparison of Packages (Maximum Dimensions in mm)
Type No. Package Drain VDSS
(V)		 VGSS
(V)		 ID
(DC)
(A)		 Ron1
(mohm)
typ/max
VGS=4.5V		 Ron2
(mohm)
typ/max
VGS=4.0V		 Ron3
(mohm)
typ/max
VGS=2.5V
μPA1870B 8pTSSOP Common 20 ± 12 ± 6.0 16.0/20.0 15.5/21.0 20.0/27.0
μPA1871 8pTSSOP Common 30 ± 12 ± 6.0 20.5/26.0 21.5/27.0 27.8/38.0
μPA1872B *1 8pTSSOP Common 20 ± 12 ± 10.0 10.0/13.0 10.5/13.5 13.0/18.0
μPA1873 8pTSSOP Common 20 ± 12 ± 6.0 18.0/23.0 19.0/24.0 24.5/29.0
μPA1874B*1 8pTSSOP Common 30 ± 12 ± 8.0 11.5/14.0 12.0/14.5 15.0/19.5
μPA2450B*1 6pHWSON Common 20 ± 12 ± 8.6 12.5/17.5 13.0/18.5 18.0/27.5
μPA2451B*1 6pHWSON Common 30 ± 12 ± 8.2 15.0/20.0 15.5/21.0 22.0/32.0
μPA2452*1 6pHWSON Common 24 ± 12 ± 7.8 17.5/21.5 18.5/22.5 25.0/30.0
μPA2754 SOP8 Separate 30 ± 12 ± 11.0 11.5/14.5 11.8/15.0 13.9/18.6
*1:Wireless bonding product  TA= 25°C


Specification List


Power Management SW
Package:SC-96 Package : SC-96
Polarity Type No. Config VDSS
(V)		 VGSS
(V)		 ID(DC)
(A)		 Ron1
(mohm)
typ/max
at1.8V		 Ron2
(mohm)
typ/max
at2.5V		 Ron3
(mohm)
typ/max
at4.5V		 Ciss
(pF)
typ		 Qg
(nC)
typ
Nch 2SK3576 Single 20 ±12 ±4.0 - 56/75 40/50 250 3.3
Pch 2SJ621 Single -12 ±8 ±3.5 63/105 46/62 35/44 660 6.6
2SJ624 Single -20 ±8 ±4.5 65/108 53/71 43/54 813 8.1
2SJ625 Single -20 ±8 ±3.0 188/314 128/171 90/113 348 2.6

Package:SC-95 Package : SC-95
Polarity Type No. Config VDSS
(V)		 VGSS
(V)		 ID(DC)
(A)		 Ron1
(mohm)
typ/max
at1.8V		 Ron2
(mohm)
typ/max
at2.5V		 Ron3
(mohm)
typ/max
at4.5V		 Ciss
(pF)
typ		 Qg
(nC)
typ
Nch μPA1901 Single 30 ±12 ±6.5 - 40/54 31/39 470 5.4
μPA1970 Dual 20 ±12 ±2.2 - 80/107 55/69 160 2.3
Pch μPA1916 Single -12 ±8 ±4.5 59/98 41/55 30/39 950 8.0
μPA1950 Dual -12 ±8 ±2.5 225/375 160/205 105/130 220 1.9
μPA1951 Dual -12 ±8 ±2.5 140/234 100/133 70/88 270 2.4
μPA1911A Single -20 ±12 ±2.5 - 122/190 82/115 370 2.3
μPA1915 Single -20 ±12 ±4.5 - 66/90 45/55 820 5.0
μPA1919 Single -20 ±12 ±6.0 - 63/84 46/58 682 6.0
μPA1917 Single -20 ±8 ±6.0 64/107 52/70 42/53 835 8.0
μPA1952 Dual -20 ±8 ±2.0 170/284 137/183 108/135 272 2.3
μPA1981 LoadSW -8 (-8) -2.8 - 76/105 52/70(5V) - -

Package:6pWSOF Package : 6pWSOF
Polarity Type No. Config VDSS
(V)		 VGSS
(V)		 ID
(DC)
(A)		 Ron1
(mohm)
typ/max
at1.8V		 Ron2
(mohm)
typ/max
at2.5V		 Ron3
(mohm)
typ/max
at4.5V		 Ron4
(mohm)
typ/max
at10V		 Ciss
(pF)
typ		 QG
(nC)
typ
Nch μPA620TT Single 20 ±12 ±5.0 - 40/54 30/38 - 450 5.5
μPA621TT Single 20 ±12 ±5.0 - 59/79 40/50 - 270 3.3
Pch μPA650TT Single -12 ±8 ±5.0 68/114 51/68 40/50 - 610 5.5
μPA651TT Single -20 ±8 ±5.0 85/142 66/88 55/69 - 600 5.5
μPA652TT Single -20 ±12 ±2.0 - 385/514 235/294 - 126 1.0
μPA654TT Single -12 ±8 ±2.5 140/234 100/133 71/88 - 250 2.7

Package : 8LD3x2MLPM
Type No. Package Config VDSS
(V)		 VGSS
(V)		 ID(DC)
(A)		 PT
(W)
#		 Ron1
(mOhm)
typ/max
at 1.8V		 Ron2
(mOhm)
typ/max
at 2.5V		 Ron3
(mOhm)
typ/max
at 4.5V		 Ciss
(pF)
typ		 QG
(nC)
typ
μPA2610T1C 8LD3x2MLPM Single -20 ± 8 ± 5 1.9 85/142 66/88 55/69 600 5.5
#Mounted on Fr-4 board PW < 10sec


SC-88 6Pin Super Mini Mold SC-88 6pin Super Mini Mold
Part No. Polarity VDS
[V]		 ID
[A]		 RDSON
(ohm)
typ/max
VGS=1.5V		 RDSON
(ohm)
typ/max
VGS=2.5V		 RDSON
(ohm)
typ/max
VGS=4.0V
μPA672T Nch 50 ±0.1 - 20/40 15/20
μPA675T Nch 16 ±0.1 20/50 7/15 5/12
μPA677TB Nch 20 ±0.35 - 0.6/0.88 0.41/0.6
μPA678TB Pch -20 ±0.25 - 2.25/2.98 1.25/1.55
μPA679TB N/P 20 ±0.25
/±0.35		 - 0.6/0.88
2.25/2.98		 0.41/0.6
1.25/1.55

SC-70 3Pin Super Mini Mold SC-70 3Pin Super Mini Mold
Part No. Polarity VDS
[V]		 ID
[A]		 RDSON
(ohm)
typ/max
VGS=1.5V		 RDSON
(ohm)
typ/max
VGS=2.5V		 RDSON
(ohm)
typ/max
VGS=4.0V
2SK1580 Nch 16 ±0.1 - 9/15 6/10
2SK3663 Nch 20 ±0.5 - 0.6/0.88 0.41/0.6
2SK1658 Nch 30 ±0.1 - 25/45 18/25
2SK2858 Nch 30 ±0.1 - 7/15 4/8
2SK1958 Nch 16 ±0.2 20/50 7/15 5/12
2SJ202 Pch -16 ±0.1 - 70/100 23/30
2SJ463A Pch -30 ±0.1 - 23/60 11/23
2SJ647 Pch -20 ±0.4 - 2.25/2.98 1.25/1.55

SC-75 Ultra Super Mini Mold SC-75 Ultra Super Mini Mold
Part No. Polarity VDS
[V]		 ID
[A]		 RDSON
(ohm)
typ/max
VGS=1.5V		 RDSON
(ohm)
typ/max
VGS=2.5V		 RDSON
(ohm)
typ/max
VGS=4.0V
2SK1824 Nch 30 ±0.1 - 7/13 5/8
2SK3107 Nch 30 ±0.1 - 7/15 4/8
2SK3664 Nch 20 ±0.5 - 0.6/0.88 0.41/0.6
2SK3503 Nch 16 ±0.1 20/50 7/15 5/12
2SJ648 Pch -20 ±0.4 - 2.25/2.98 1.25/1.55
2SJ243 Pch -30 ±0.1 - 55/100 20/25
2SJ559 Pch -30 ±0.1 - 23/60 11/23


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