Lead-free

Are all NEC Electronics products being replaced with lead-free products?

In principle, we are going to replace all products containing lead with lead-free products, but it won't be possible to replace them all.
For example, since automotive and communications devices are not subject to the (European) RoHS Directive, some of these semiconductor devices have not been replaced yet, in order to avoid interrupting our customers' application set production.
Basically, we will continue producing conventional leaded products in parallel with lead-free product production.

All newly developed products, however, will be lead free.
Moreover, since October 2006, all optical and RF/microwave devices have been manufactured as lead-free devices.
For more information on lead-free devices, please see our lead-free product list.

(2007/06)

What are used as the solder materials of lead-free products?

The materials are classified as follows by pin processing.
  External solder plating: Sn-Bi (tin-bismuth) or Sn (tin), Ni-Pd-Au (nickel-palladium-gold) (differs depending on the product)
  External solder dip (Note): Sn-Ag-Cu (tin-sliver-copper)
  Solder ball: Sn-Ag-Cu (tin-sliver-copper)

  Note:
     THD (Through Hole Device) type of discrete product (however, Sn-Bi for TO-251 (MP-3))

The other package materials are the same as lead solder products.

(2007/06)

What is the quantity of materials other than Sn contained in solder with which the pins of lead-free products are plated?

The packaging of lead-free products includes:
Sn-Bi: Approx. 2wt% of Bi
Sn-Ag-Cu: Approx. 3wt% of Ag and 0.5wt% of Cu

Please see our Lead-Free Semiconductor Products pamphlet for details.

(2007/06)

Which part of a lead-free product uses a high melting point solder?

A high melting point solder containing lead is used as a die attach (die bond) that fixes the chip to the lead frame. For the relationship between the chip and the lead frame, refer to "How Semiconductors Are Made" on NEC Electronics' website. In " Mounting" on this website, the material described as "silver paste resin" is the die attach.
Power devices employ high melting point solder because the chip temperature reaches to a high level. Containing lead in this part is not subject to RoHS regulation because of the problem of alternate materials.

What does the symbol "wt%" used in A2 above and in the Lead-Free Semiconductor Products pamphlet mean?

This symbol refers to the unit "weight per cent".
For example, "Sn-3Ag-0.5Cu" means Sn-Ag-Cu with Ag of 3wt% and Cu of 0.5wt%.
In the pamphlet, the maximum allowable amount according to the RoHS directive is indicated by the unit "ppm" (part per million: 1/1,000,000); however, this has the same meaning as "weight per cent". In other words, 1000 ppm = 0.1wt%.

(2006/09)

Are the part numbers of the lead-free products different?

The marked part number is the same for most products because they are not different in chip and package shape.
The index mark is printed on the marking side.
However, there is no difference for small packages that do not have a printing space.

A classification symbol is suffixed to the part number. This symbol differs as follows depending on the product.

External solder (Note 1)	Sn-Bi, Sn-Ag-Cu	Sn	Ni-Pd-Au
Completely lead-free	-A	-AT	-AX
Lead-free pins (Note 2)	-AZ	-AY	None

A classification code indicating lead-free products prefixes the code of the country (e.g., /JM) where the products were manufactured.
Note, however, that the package shape does differ in a very small number of products, so these products have a different order part number. Be careful, therefore, to check each product with your local sales office before purchase.

(2007/06)

Various lead-free codes are available for your products, but may they be freely specified?

No. The code to be specified depends on the product. For the codes attached to individual product names, check the lead-free product list or other product-related document.
Two codes, "-A and -AT" or "-AZ and -AY", are sometimes used for discrete devices and linear ICs, but specify -AT or -AY (Sn plating) for new purchases. For on-going purchases, -A and -AZ (Sn-Bi plating) may still be used, but since such products may be purchased from distributors such as Web shops if the distributors have the products in general stock, please check with your dealer for specific supplies.
For some microcontrollers, the two codes "-A" and "-AX" are used, but either may be specified.
For solder ball products, we have no plan to substitute the Sn-Ag-Cu solder for a different material.

(2008/02)

It seems that CCD sensor pins are not solder-plated in the first place. Do products with -AZ suffixed contain high melting point solder?

No. Some CCD sensors contain lead in their glass parts and this is indicated by -AZ. Those that do not contain lead in the glass part are suffixed with -A.

(2008/04)

What is the standard position of the lead-free mark?

The standard positions are as follows, usually near the pin 1 mark.



is the basic position, but the mark may appear at or, depending on the product.
There are also products that do not conform to this standard, so take care with the mounting direction on the board, making sure not to confuse the lead-free mark with the pin 1 mark.
Some products do not have the lead-free mark because of limited space.

(2007/04)

Are the lead-free marks unified?

They are not completely unified.
As for the marking position, it assumes the neighborhood of the 1 pin index, and so on, but there is different one.
The following figure shows an example that needs an attention by the distinction.


The marking methods are the paint and laser (It doesn't sink in).
The shape of lead-free marks is a circle.

Can a lead-free product be identified while it is in its packing box?

Lead-free product can be identified on the label on the packing box or reel of tape-packaged products.
Lead-free products have "Pb-Free T." shown in the upper right part of the label.
"INTP" which shows the full order code has a code, such as "-A" or "-AZ", that indicates a lead-free product.

(2006/11)

Are there any differences in function and performance between the conventional products and lead-free products?

There are no differences in function and performance. Only the solder and recommended soldering conditions differ.

The data sheets of lead-free products are needed as a currently used product is to be replaced by a lead-free product. Are they available?

The characteristics and package of most of the lead-free products hardly differ from those of conventional products with lead. The data sheets of the conventional products (with lead) can be used as they are.

(2006/10)

What is the value of LnH(t) on the right of the graph of the temperature cycle life in the "Lead-free Semiconductor Products" brochure?

LnH(t) is a parameter for estimating the hazard probability of the Weibull distribution.
logarithm and H(t) indicates the Weibull distribution.

Do the insulator bushing and insulator plate attached to the power transistor comply with the RoHS Directive?

Yes, the insulator bushing and insulator plate which we provide do not contain any of the six substances specified by the RoHS Directive.

(2006/10)